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首页> 外文期刊>Components, Packaging and Manufacturing Technology, IEEE Transactions on >In-Plane Deformation Measurement of Thin Packages Using an Atomic Force Microscope Moiré Method With a Pseudo-Phase-Shifting Technique
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In-Plane Deformation Measurement of Thin Packages Using an Atomic Force Microscope Moiré Method With a Pseudo-Phase-Shifting Technique

机译：使用伪相移技术的原子力莫尔条纹法测量薄包装的平面变形

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摘要

High-resolution microscope Moiré methods have recently been used to measure small deformations in specimens occasionally due to some restrictions on the use of optical measurement techniques. The atomic force microscope (AFM) Moiré method, a type of high-resolution microscope Moiré method, is usually adopted to measure the in-plane deformation of electronic packages due to the simple process of specimen preparation associated with this process. The sensitivity of the AFM Moiré method is determined by the frequency of the specimen and the reference grating. The latter is controlled by varying the pitch of the AFM scanning lines. Therefore, a high-frequency reference grating is easily achieved by decreasing the pitch. On the other hand, it is difficult to form a high-frequency specimen grating on the surface of a thin package. Alternatively, a phase-shifting technique can be employed with the Moiré method to enhance the sensitivity using a specimen grating with a relatively low grating frequency. However, some obstacles exist when doing this, including the hysteretic behavior that arises in the specimen stage actuator of the AFM system and areas mismatch among the phase-shifted images. In this paper, a pseudo-phase-shifting technique is proposed to overcome the obstacles of the AFM system. An image-decomposition algorithm that obtains phase-shifted images is also presented. For an application of the AFM Moiré method, in-plane deformations of a chip-on-flex package with thin thickness were investigated using the proposed technique. The effects of the specimen grating on the specimen were also evaluated through a finite element analysis.
机译：由于光学测量技术的使用受到一些限制，高分辨率的莫尔显微镜方法最近已用于偶尔测量样品中的微小变形。原子力显微镜（AFM）莫尔（Moiré）方法是一种高分辨率显微镜莫尔（Moiré）方法，由于与此过程相关的标本制备过程很简单，因此通常用于测量电子包装的面内变形。原子力显微镜莫尔方法的灵敏度取决于样品和参考光栅的频率。后者是通过改变AFM扫描线的间距来控制的。因此，通过减小间距容易地获得高频参考光栅。另一方面，难以在薄包装的表面上形成高频试样光栅。可替代地，可以使用具有相对较低光栅频率的样本光栅的莫尔（Moiré）方法来采用相移技术来提高灵敏度。但是，这样做时会遇到一些障碍，包括在AFM系统的样品台执行器中出现的磁滞行为以及相移图像之间的区域不匹配。本文提出了一种伪相移技术来克服AFM系统的障碍。还提出了一种获得相移图像的图像分解算法。对于AFMMoiré方法的应用，使用所提出的技术研究了厚度薄的挠性芯片封装的面内变形。还通过有限元分析评估了样品光栅对样品的影响。

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