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Theoretical Study of InAlN/GaN High Electron Mobility Transistor (HEMT) with a Polarization-Graded AlGaN Back-Barrier Layer

机译:具有极化梯度AlGaN背势垒层的InAlN / GaN高电子迁移率晶体管(HEMT)的理论研究

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An inserted novel polarization-graded AlGaN back barrier structure is designed to enhance performances of In 0.17 Al 0.83 N/GaN high electron mobility transistor (HEMT), which is investigated by the two-dimensional drift-diffusion simulations. The results indicate that carrier confinement of the graded AlGaN back-barrier HEMT is significantly improved due to the conduction band discontinuity of about 0.46 eV at interface of GaN/AlGaN heterojunction. Meanwhile, the two-dimensional electron gas (2DEG) concentration of parasitic electron channel can be reduced by a gradient Al composition that leads to the complete lattice relaxation without piezoelectric polarization, which is compared with the conventional Al 0.1 Ga 0.9 N back-barrier HEMT. Furthermore, compared to the conventional back-barrier HEMT with a fixed Al-content, a higher transconductance, a higher current and a better radio-frequency performance can be created by a graded AlGaN back barrier.
机译:设计了一种插入的新型极化渐变AlGaN背势垒结构,以增强In 0.17 Al 0.83 N / GaN高电子迁移率晶体管(HEMT)的性能,这是通过二维漂移扩散仿真研究的。结果表明,由于GaN / AlGaN异质结界面处的导带不连续性约为0.46 eV,梯度AlGaN背势垒HEMT的载流子约束得到了显着改善。同时,可以通过梯度Al成分降低寄生电子通道的二维电子气(2DEG)浓度,从而导致完全的晶格弛豫而无压电极化,这与常规的Al 0.1 Ga 0.9 N背垒HEMT相比。此外,与具有固定Al含量的常规背栅HEMT相比,渐变的AlGaN背栅可以产生更高的跨导,更高的电流和更好的射频性能。

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