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首页> 外文期刊>Electron Devices, IEEE Transactions on >Design of a Reverse-Connected Module for Nanostructure Removal From Display Color Filters
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Design of a Reverse-Connected Module for Nanostructure Removal From Display Color Filters

机译：一种用于显示滤色镜的纳米结构去除的反向连接模块的设计

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摘要

This paper proposes a new design module for reverse-connected microelectrochemical machining ( $mu$-ECM), which is based on a novel electrochemical reaction that offers the fast removal of indium-tin-oxide (ITO) nanostructures from the surfaces of color filters in displays. Unlike general $mu$-ECM models, the reverse-connected $mu$-ECM model is implemented by connecting a workpiece to the cathode and an electrode to the anode of a dc power supply. During the course of machining, electrons travel from the cathode to the anode, so that the ITO film is lifted and removed at high speed by an electric field. In general $mu$-ECM models, a workpiece is connected to the anode, an electrode is connected to the cathode, and the material removal is achieved by dissolution. In contrast, the reverse-connected $mu$-ECM model provides higher removal efficiency and higher surface quality of color filters in displays during machining processes, thereby breaking new ground in superfine machining for applications in the photoelectric semiconductor industry.
机译：本文提出了一种用于反向连接微电化学加工（$ mu $ -ECM）的新设计模块，该模块基于一种新颖的电化学反应，可快速从彩色滤光片表面去除铟锡氧化物（ITO）纳米结构。在显示中。与一般的μ-ECM模型不同，反向连接的μ-ECM模型是通过将工件连接到直流电源的阴极以及将电极连接到阳极来实现的。在加工过程中，电子从阴极行进到阳极，因此ITO薄膜通过电场被高速提起和去除。在通常的μ-ECM模型中，将工件连接到阳极，将电极连接到阴极，并且通过溶解实现材料去除。相反，反向连接的mu-ECM模型可在加工过程中提供更高的去除效率和更高的彩色滤光片表面质量，从而为光电半导体行业的超精细加工开辟了新天地。

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