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机译:带有硅中介层的3D ICS的电互连和微流体冷却的制造与表征
School of Electrical and Computer Engineering, Georgia Institute of Technology, 791 Atlantic NW, Pettit Bldg., Atlanta, GA 30332, USA;
School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, Georgia, USA;
School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, Georgia, USA;
School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, Georgia, USA;
School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, Georgia, USA;
机译:硅插入器上的3D多模光学互连的设计,制造和比较
机译:一种新型的中介层的制造和电学特性,该中介层具有用于2.5D / 3D应用的具有超低电阻率的直通硅通孔(TSV)的聚合物衬里和硅柱
机译:利用微流体冷却的硅中介层平台,用于高性能计算系统
机译:3D IC和硅中介层中的电互连和微流体冷却
机译:高效的3D准微流体流模型的开发以及All-PDMS光电微流体流式细胞仪的制造和表征。
机译:3D打印的高密度可逆的芯片到芯片微流体互连
机译:硅插入器中硅电容器(TSC)的电模型及其表征
机译:用于实现硅混合晶圆级集成的多层铝互连的制作和电气特性