• 主题
高级搜索  >
历史搜索 清空历史
首页> 外文期刊>IEEE transactions on electronics packaging manufacturing >Preventing conductive white residue formation by modifying the manufacturing process
【24h】

Preventing conductive white residue formation by modifying the manufacturing process

机译：通过修改制造工艺来防止形成导电的白色残留物

获取原文
获取原文并翻译 | 示例
       
页面导航
  • 摘要
  • 著录项
  • 相似文献
  • 相关主题

摘要

Soldering has long been the dominant means by which the electronic components are attached, mechanically and electrically to the circuits in which they will operate. The final step of the soldering process has traditionally been to clean the assemblies using an aggressive Chlorofluorocarbon (CFC) based cleaner to remove any "residue" which could retard electrical performance. Recently these cleaners have been banned by international convention requiring that the electronics industry look at the cleaning (and soldering) process in detail and identify ways to produce reliable electronics without using CFC cleaners. To explore every possible alternative to CFC cleaning, and make an evaluation is a complicated task, and could take years. This is beyond the scope of any one company who would have neither the time nor the funds to conduct such a detailed analysis. Such large-scale, detailed, exploratory work can be completed at an academic institution. However in the university environment one cannot typically verify their results in a "real" situation, as industrial guidance is necessary. Thus Boeing, Rensselaer, EMPF, and the Naval Air Warfare Center (NAWC) formed a collaborative project to address the cleaning problem. The challenge was to identify means by which conductive residue formation could be eliminated in the manufacturing environment-in the time period of one year. Simple experiments which simulated the wave soldering process were conducted at Rensselaer under the guidance of Boeing, EMPF, and NAWC. These results were assessed in a large-scale manufacturing environment at Boeing. By working together and pooling our strengths it was possible in a 15 month period to do the following. 1) Propose a two-step reaction mechanism describing residue formation in a humid environment. 2) Determine that controlling the fluxing reaction is likely to be the most effective way to reduce the likelihood of residue formation. 3) Examine the kinetics of residue formation in a humid environment. At the end of the paper ideas for future examination of this process are discussed, as is our evaluation of the collaboration. One benefit of such short-term collaborative efforts is that bachelors and masters level students and gain industrially significant experience at school. The results of this project are available on-line at http://saturn.vcu.edu/mapalmer/residue.
机译：长期以来，焊接一直是主要的手段，通过这些手段，电子部件可以机械地和电气地连接到将要运行的电路上。传统上，焊接过程的最后一步是使用侵蚀性的基于氯氟烃（CFC）的清洁剂清洁组件，以去除可能阻碍电气性能的任何“残留物”。最近，这些清洁剂已被国际公约禁止，要求电子行业详细研究清洁（和焊接）过程，并确定不使用CFC清洁剂来生产可靠的电子产品的方法。探索各种可能的替代CFC清洁方法并进行评估是一项复杂的任务，可能需要数年时间。这超出了没有时间和资金来进行这种详细分析的任何一家公司的范围。这样的大规模，详细的探索性工作可以在学术机构中完成。但是，在大学环境中，由于需要行业指导，因此通常无法在“真实”情况下验证其结果。因此，波音，伦斯勒，EMPF和海军空战中心（NAWC）组成了一个合作项目，以解决清洁问题。挑战在于确定在一年的时间内可以消除制造环境中导电残留物形成的方法。在波音，EMPF和NAWC的指导下，在Rensselaer进行了简单的模拟波峰焊过程的实验。这些结果是在波音公司的大规模生产环境中评估的。通过共同努力并汇集我们的优势，有可能在15个月内完成以下工作。 1）提出两步反应机理，描述在潮湿环境中残留物的形成。 2）确定控制助熔剂反应可能是减少残留物形成可能性的最有效方法。 3）检查潮湿环境中残留物形成的动力学。在本文的最后，讨论了用于此过程的将来检查的想法，以及我们对协作的评估。这种短期合作的好处之一是学士和硕士水平的学生可以在学校获得行业上重要的经验。该项目的结果可从http://saturn.vcu.edu/mapalmer/residue在线获得。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱：kefu@zhangqiaokeyan.com

京公网安备：11010802029741号 ICP备案号：京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有

  • 客服微信

  • 服务号