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首页> 外文期刊>IEEE transactions on electronics packaging manufacturing >Novel bi-layer conformal coating for reliability without hermeticity MEMS encapsulation
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Novel bi-layer conformal coating for reliability without hermeticity MEMS encapsulation

机译：新型双层保形涂层，无需密封MEMS封装即可实现可靠性

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摘要

A flexible, smooth, and low profile conformal coating was developed to accomplish the encapsulation of a microelectromechanical system (MEMS) device that will be applied to sense the static pressure on aircraft during real flight testing. The encapsulant should be able to protect the MEMS device and the multichip module (MCM) from adverse environmental conditions, i.e., mechanical shock, temperature fluctuation, engine fuel and oil contamination, and moisture/mobile ion permeation. Presently, conventional packaging schemes for electronics cannot satisfy this specific outdoor application, and a new encapsulation combination has been designed in accord with the requirement of reliability without hermeticity (RWOH). A bi-layer structure was selected because of property limitations of a single material. Pliable elastomeric silicones are typically flexible, water repellent, and abrasion resistant. The silicone encapsulant will be first applied to planarize the MEMS surface and function as durable dielectric insulation, stress-relief, and shock/vibration absorbers over a wide humidity/temperature range. To compensate for the deficiency of silicone on engine fuel/oil contamination, Parylene C is to be deposited afterward. This bi-layer coating can achieve excellent bulk properties, such as moisture and mobile ion barrier resistance, chemical compatibility, and electrical insulation characteristics. However, the poor adhesion of Parylene C to silicone greatly restricts its application. To address this problem, silane coupling agents were used as an adhesion promoter. Significant adhesion improvement was achieved by placing an interlayer silane coupling agent to provide interfacial bonding to the silicone elastomeric surface and the Parylene C film. Furthermore, a possible mechanism of adhesion enhancement will also be presented in this study.
机译：开发了一种柔性，光滑且低轮廓的保形涂层，以完成微机电系统（MEMS）装置的封装，该装置将用于在实际飞行测试期间感测飞机上的静压力。密封剂应能够保护MEMS器件和多芯片模块（MCM）免受不利环境条件的影响，例如机械冲击，温度波动，发动机燃料和机油污染以及湿气/移动离子的渗透。当前，用于电子设备的常规封装方案不能满足该特定的户外应用，并且已经根据可靠性和无气密性（RWOH）的要求设计了新的封装组合。由于单一材料的性能限制，选择了双层结构。柔软的弹性硅树脂通常具有柔韧性，防水性和耐磨性。硅酮密封剂将首先用于平坦化MEMS表面，并在宽湿度/温度范围内用作耐用的介电绝缘，应力消除和冲击/振动吸收剂。为了弥补有机硅对发动机燃油/机油污染的不足，随后应沉积聚对二甲苯C。这种双层涂层可以实现出色的整体性能，例如防潮性和抗移动离子阻挡性，化学相容性以及电绝缘特性。然而，聚对二甲苯C对有机硅的不良粘合性极大地限制了其应用。为了解决该问题，将硅烷偶联剂用作增粘剂。通过放置层间硅烷偶联剂以提供与有机硅弹性体表面和聚对二甲苯C膜的界面键合，可以显着提高附着力。此外，本研究还将介绍一种可能的增粘机制。

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