Initial investigations into low-cost ultra-fine pitch solder printing process based on innovative laser printing technology

Walker A.; Baldwin D.F.

首页> 外文期刊>IEEE transactions on electronics packaging manufacturing >Initial investigations into low-cost ultra-fine pitch solder printing process based on innovative laser printing technology

【24h】

Initial investigations into low-cost ultra-fine pitch solder printing process based on innovative laser printing technology

机译：基于创新激光印刷技术的低成本超细间距焊锡印刷工艺的初步研究

获取原文

获取原文并翻译 | 示例

掌桥外文数据库（机构版） >>

开具论文收录证明 >>

页面导航

摘要
著录项
相似文献
相关主题

摘要

Advances in electronics packaging and assembly technology are driving increased demand for ultra-fine pitch solder deposition. In this work, innovative solder deposition techniques based on laser printing are investigated for low-cost ultra-fine pitch printing applications. This paper investigates the feasibility of using solder particles in off-the-shelf xerographic technology. The physics of two development systems (dual component and monocomponent) is discussed. This inquisition leads to a discussion of triboelectric charging of the solder toners, coating the solder with thin dielectrics, and charge induction by an applied electric field. This initial investigation explores the basic feasibility of xerographic printing techniques using solder and defines future work.

机译：电子封装和组装技术的进步推动了对超细间距焊料沉积的需求不断增长。在这项工作中，针对低成本超细间距印刷应用，研究了基于激光印刷的创新性焊料沉积技术。本文研究了在现成的静电复印技术中使用焊料颗粒的可行性。讨论了两个开发系统（双组件和单组件）的物理学。该研究导致对焊料调色剂的摩擦带电，用薄电介质涂覆焊料以及由施加的电场引起的电荷感应的讨论。这项初步研究探索了使用焊料的静电印刷技术的基本可行性，并确定了未来的工作。

著录项

来源
《IEEE transactions on electronics packaging manufacturing》 |1999年第4期|P.303-307|共5页
作者
Walker A.; Baldwin D.F.;
展开▼
作者单位

展开▼
收录信息
原文格式 PDF
正文语种 eng
中图分类一般性问题;
关键词

相似文献

外文文献
中文文献
专利

1. Ultra-Fine Pitch Stencil Printing for a Low Cost and Low Temperature Flip-Chip Assembly Process [J] . Robert W. Kay, Stephen Stoyanov, Greg P. Glinski, IEEE Transactions on Components and Packaging Technologies . 2007,第期

机译：超细间距模板印刷，用于低成本和低温倒装芯片装配工艺
2. Fine pitch stencil printing of Sn/Pb and lead free solders for flip chip technology [J] . Kloeser J., Heinricht K. IEEE transactions on components, packaging, and manufacturing technology. Part C, Manufacturing . 1998,第1期

机译：用于倒装芯片技术的Sn / Pb和无铅焊料的精细间距模板印刷
3. Sub process challenges in ultra fine pitch stencil printing of type-6 and type-7 Pb-free solder pastes for flip chip assembly applications [J] . G. J. Jackson, M. W. Hendriksen, R. W. Kay, Soldering & Surface Mount Technology . 2005,第1期

机译：用于倒装芯片组装应用的6型和7型无铅焊膏的超细间距模板印刷中的子工艺挑战
4. Initial investigations into low-cost ultra-fine pitch solder printing process based on innovative laser printing technology [C] . Walker, A., Baldwin, . 1999

机译：基于创新激光印刷技术的低成本超细间距焊料印刷工艺的初步研究
5. Modeling and process optimization of solder paste stencil printing for micro-BGA and fine pitch surface mount assembly [D] . Pan, Jianbiao 2000

机译：微型BGA和细间距表面贴装组件的锡膏模版印刷建模和工艺优化
6. Eco-Friendly Lead-Free Solder Paste Printing via Laser-Induced Forward Transfer for the Assembly of Ultra-Fine Pitch Electronic Components [O] . Marina Makrygianni, Filimon Zacharatos, Kostas Andritsos, 2021

机译：通过激光引导的超细俯仰电子元件组装的激光诱导的前进转印的环保无铅焊膏印刷
7. Maskless Screen Printing Process using Solder Bump Maker (SBM) for Low-cost, Fine-pitch Solder-on-Pad (SoP) Technology [O] . Kwang-Seong Choi, Haksun Lee, Hyun-Cheol Bae, 2013

机译：无掩模丝网印刷工艺使用焊料凸块制造商（SBM）用于低成本，细大螺距焊垫（SOP）技术

Initial investigations into low-cost ultra-fine pitch solder printing process based on innovative laser printing technology

摘要

著录项

相似文献

相关主题

期刊订阅