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首页> 外文期刊>IEEE transactions on industrial informatics >A Multiparameter Numerical Modeling and Simulation of the Dipping Process in Microelectronics Packaging
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A Multiparameter Numerical Modeling and Simulation of the Dipping Process in Microelectronics Packaging

机译：微电子封装中浸渍工艺的多参数数值建模与仿真

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摘要

In order to simulate the flux dipping process of microbump flip chip bonding, multiparameter experiments are designed. The dipping process of microbumps is captured by the high-speed camera, so that we can obtain the quantitative relationship between the dipping quantity and its viscosity, dipping speed, dipping depth, and dipping time by virtue of image processing. Furthermore, corresponding mathematical models are established by curve fitting. Finally, all of the numerical models are integrated; numerical simulation is carried out by MATLAB-Simulink and graphical user interface; and a new simulation software is developed, thus providing an important basis and guidance for flux dipping application and parameter selection.
机译：为了模拟微凸点倒装芯片焊接的助焊剂浸渍过程，设计了多参数实验。微凸点的浸入过程由高速相机捕获，因此我们可以通过图像处理获得浸入量及其粘度，浸入速度，浸入深度和浸入时间之间的定量关系。此外，通过曲线拟合建立相应的数学模型。最后，所有数值模型都已集成。通过MATLAB-Simulink和图形用户界面进行数值模拟；并开发了新的仿真软件，从而为磁通浸渍应用和参数选择提供了重要的依据和指导。

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