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Influence of Base Resistance on Extracting Thermal Resistance for SiGe HBTs

机译:基极电阻对SiGe HBT提取热阻的影响

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In this article, the influence of base resistance on extracting thermal resistance for SiGe heterojunction bipolar transistors is studied and an improved approach for deter-mining the junction temperature and thermal resistance is presented. The proposed method for extracting thermal resistance is based on the temperature sensitivity of the base-emitter (B-E) voltage when the device is biased with a fixed emitter current density. This approach not only takes into account the self-heating during the different ambient temperature mea-surement but also revises the empirical equation of B-E voltage due to the influence of base resistance during the power dissipation increment measurement Results are obtained for devices with different emitter lengths and fingers. Compared with the conventional method, the thermal resistance is about up to 15% improvement for the device with 0.3 × 1.9 μm~2 emitter area and 13.8% for the device with 0.3 × 13.9 μm~2 emitter area. The accurate ther-mal resistance implemented in HICUM model has resulted in better fit for transistor output characteristics.
机译:本文研究了基极电阻对SiGe异质结双极晶体管提取热阻的影响,并提出了一种确定结温和热阻的改进方法。提出的提取热阻的方法是基于当器件以固定的发射极电流密度偏置时,基极-发射极(B-E)电压的温度敏感性。这种方法不仅考虑了在不同环境温度测量过程中的自发热,而且还修正了在功率耗散增量测量期间由于基极电阻的影响而产生的BE电压的经验方程式。和手指。与传统方法相比,发射面积为0.3×1.9μm〜2的器件的热阻提高了约15%,发射面积为0.3×13.9μm〜2的器件的热阻提高了13.8%。在HICUM模型中实现的准确的热电阻已使晶体管输出特性更加合适。

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