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首页> 外文期刊>Journal of Applied Physics >Electromigration analysis of solder joints under ac load: A mean time to failure model
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Electromigration analysis of solder joints under ac load: A mean time to failure model

机译：交流负载下焊点的电迁移分析：平均失效时间模型

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摘要

In this study, alternating current (ac) electromigration (EM) degradation simulations were carried out for Sn95.5%Ag4.0%Cu0.5 (SAC405-by weight) solder joints. Mass transport analysis was conducted with viscoplastic material properties for quantifying damage mechanism in solder joints. Square, sine, and triangle current wave forms ac were used as input signals, dc and pulsed dc (PDC) electromigration analysis were conducted for comparison purposes. The maximum current density ranged from 2.2 × 10~6 A/cm~2 to 5.0 × 10~6 A/cm~2, frequency ranged from 0.05 Hz to 5 Hz with ambient temperature varying from 350 K to 450 K. Because the room temperature is nearly two-thirds of SAC solder joint's melting point on absolute temperature scale (494.15 K), viscoplastic material model is essential. Entropy based damage evolution model was used to investigate mean time to failure (MTF) behavior of solder joints subjected to ac stressing. It was observed that MTF was inversely proportional to ambient temperature T~(1.1) in Celsius and also inversely proportional to current density j~(0.27) in A/cm~2. Higher frequency will lead to a shorter lifetime with in the frequency range we studied, and a relationship is proposed as MTF ∝ f~(-0.41). Lifetime of a solder joint subjected to ac is longer compared with dc and PDC loading conditions. By introducing frequency, ambient temperature and current density dependency terms, a modified MTTF equation was proposed for solder joints subjected to ac current stressing.
机译：在这项研究中，对Sn95.5％Ag4.0％Cu0.5（按重量计SAC405）焊点进行了交流（ac）电迁移（EM）退化模拟。使用粘塑性材料特性进行了传质分析，以量化焊点的损伤机理。方波，正弦波和三角形电流波形ac被用作输入信号，进行了dc和脉冲dc（PDC）电迁移分析以进行比较。最大电流密度范围从2.2×10〜6 A / cm〜2到5.0×10〜6 A / cm〜2，频率从0.05 Hz到5 Hz，环境温度从350 K到450 K不等。在绝对温度范围（494.15 K）上，温度几乎是SAC焊点熔点的三分之二，粘塑性材料模型至关重要。基于熵的损伤演化模型用于研究承受交流应力的焊点的平均失效时间（MTF）行为。可以看出，MTF与摄氏环境温度T〜（1.1）成反比，与电流密度j〜（0.27）成反比（A / cm〜2）。在我们研究的频率范围内，较高的频率将导致较短的寿命，并提出了一种与MTF ∝ f〜（-0.41）的关系。与直流和PDC负载条件相比，经受交流电的焊点的寿命更长。通过引入频率，环境温度和电流密度相关项，提出了一种经过修正的MTTF方程，用于承受交流电流应力的焊点。

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  • 来源
    《Journal of Applied Physics》 |2012年第6期|p.063703.1-063703.12|共12页
  • 作者

    Wei Yao; Cemal Basaran;

  • 作者单位

    Electronic Packaging Laboratory, Department of Civil, Structural and Environmental Engineering,University at Buffalo, The State University of New York, Buffalo, New York 14260, USA;

    Electronic Packaging Laboratory, Department of Civil, Structural and Environmental Engineering,University at Buffalo, The State University of New York, Buffalo, New York 14260, USA;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
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