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首页> 外文期刊>Journal of Manufacturing Processes >Near-IR nanosecond laser direct writing of multi-depth microchannel branching networks on silicon
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Near-IR nanosecond laser direct writing of multi-depth microchannel branching networks on silicon

机译:硅上多深度微通道分支网络的近红外纳秒激光直接写入

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摘要

Multi-depth microchannel network is fabricated on silicon using near-IR nanosecond laser direct writing followed by chemical etching. An 11-level branching network, for which the depth ranges from 20 to 200 pm, is designed and fabricated to be used as a mold for PDMS replica. The bifurcation of the microchannels is designed according to Murray's law so that the total cost function is minimized. The detailed fabrication procedure and parameters are presented, and method of roughness control using both laser processing parameters and etching parameters are discussed. The efficient manufacturing of such microchannels with minimal roughness can pave new roads for realizing microdevices with multi-depth microchannels. Such devices have proven use in environmental/biomedical applications such as artificial lungs.
机译:使用近红外纳秒激光直接写入,然后进行化学蚀刻,在硅上制造多深度微通道网络。设计和制造了一个11级分支网络,其深度范围为20到200 pm,可用作PDMS复制品的模具。根据穆雷定律设计微通道的分叉,以使总成本函数最小化。介绍了详细的制造过程和参数,并讨论了同时使用激光加工参数和蚀刻参数进行粗糙度控制的方法。这种具有最小粗糙度的微通道的有效制造可以为实现具有多深度微通道的微器件铺平道路。这种设备已被证明可用于环境/生物医学应用,例如人造肺。

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