Sedimentation of Cu-rich intermetallics in liquid lead-free solders

Jenn-Ming Song; Yu-Lin Shen; Hsin-Yi Chuang

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Sedimentation of Cu-rich intermetallics in liquid lead-free solders

机译：液态无铅焊料中富铜金属间化合物的沉淀

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This study investigated the behavior of Cu-containing intermetallic compounds (IMCs) in liquid Sn-Ag and Sn-Zn solders. Experimental results show that for the intermetallics investigated, Cu-Sn and Cu-Zn compounds, the occurrence of settling was dominated by the crystalline temperature of IMCs, buoyancy due to difference in densities, and dissolution potential for the compounds into the liquid. The complete dissolution of Cu—Zn compounds, which took place in the Sn-Zn solders when the Cu content exceeded a critical value, might be ascribed to the depletion of Zn in the melt.

机译：这项研究调查了含铜金属间化合物（IMC）在液态Sn-Ag和Sn-Zn焊料中的行为。实验结果表明，对于所研究的金属间化合物Cu-Sn和Cu-Zn化合物，沉降的发生主要取决于IMC的结晶温度，由于密度不同而产生的浮力以及化合物在液体中的溶解潜力。当Cu含量超过临界值时，在Sn-Zn焊料中发生的Cu-Zn化合物的完全溶解可能归因于熔体中Zn的消耗。

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来源
《Journal of Materials Research》 |2007年第12期|p.3432-3439|共8页
作者
Jenn-Ming Song; Yu-Lin Shen; Hsin-Yi Chuang;
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作者单位

Department of Materials Science and Engineering, National Dong Hwa University, Hualien 974, Taiwan;

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收录信息美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
原文格式 PDF
正文语种 eng
中图分类工程材料学;
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Sedimentation of Cu-rich intermetallics in liquid lead-free solders

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