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首页> 外文期刊>Journal of Materials Science: Materials in Electronics >Effect of silver nanostructures on the resistivity of electrically conductive adhesives composed of silver flakes
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Effect of silver nanostructures on the resistivity of electrically conductive adhesives composed of silver flakes

机译：银纳米结构对薄片状导电胶电阻率的影响

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摘要

Silver flakes are the most widely applied conductive fillers in electrically conductive adhesives (ECAs) because of their high conductivity and stable chemical properties. It is expected that there are advanced ECAs with both high electrical conductance and good adhesive strength. The high filler loadings can improve the conductance of ECAs, whereas the adhesive strength is decreased. Silver nanostructures are incorporated for the purpose of electrical conductance and adhesive strength improvement of ECAs. A simple method has enabled the synthesis of silver nanostructures by reducing silver nitrate with ethylene glycol in the presence of poly(N-vinylpyrrolidone). They are added to ECAs by dispersing them in ethanol while it is used as the diluent to adjust the volatility of ECAs, preventing them from the aggregation. This proposed process offers the possibility to effectively use silver nanostructures for improving the conductivity of ECAs at the low content of conductive fillers while good adhesive strength may be obtained.
机译：银鳞片由于其高导电性和稳定的化学性质而成为导电胶（ECA）中应用最广泛的导电填料。期望有同时具有高电导率和良好粘合强度的先进ECA。高填充量可以提高ECA的电导率，而粘合强度会降低。引入银纳米结构是为了提高ECA的导电性和粘合强度。一种简单的方法能够通过在聚（N-乙烯基吡咯烷酮）存在下用乙二醇还原硝酸银来合成银纳米结构。通过将它们分散在乙醇中将它们添加到ECA中，同时将其用作稀释剂以调节ECA的挥发性，防止它们聚集。该提出的方法提供了有效地使用银纳米结构以在低导电填充剂的情况下改善ECA的导电性的可能性，同时可以获得良好的粘合强度。

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