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首页> 外文期刊>Journal of Vacuum Science & Technology. B, Microelectronics and Nanometer Structures >Level set modeling of the orientation dependence of solid phase epitaxial regrowth
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Level set modeling of the orientation dependence of solid phase epitaxial regrowth

机译:固相外延再生取向相关性的能级模型

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摘要

Level set methods have previously been successfully implemented in interface propagation for etching and deposition processes. In this article, the authors show that level set methods can be used to model solid phase epitaxial regrowth. The model incorporates orientation dependence of regrowth as found by Csepregi et al. [J. Appl. Phys. 49, 3906 (1978)]. The orientation dependent velocity data are taken from Csepregi's paper and fitted to a polynomial function to give the growth velocity for level set methods. Simulations show the capability of our model in predicting the pinching of the corners in < 111 > direction and humplike shape in < 100 > direction. This is confirmed by the transmission electron microscope pictures from recent papers. This modeling holds special interest because of the different diffusivities of boron in amorphous and crystalline silicon (approximately five orders of magnitude difference) and because of the various defects forming at the pinching corners which could lead to higher leakage current in scaled devices. The level set model is implemented in FLOOPS.
机译:水平集方法先前已成功地在用于蚀刻和沉积过程的界面传播中实现。在本文中,作者表明,可以使用能级集方法对固相外延再生进行建模。该模型结合了Csepregi等人发现的再生长的方向依赖性。 [J.应用物理49,3906(1978)]。方向相关的速度数据取自Csepregi的论文,并拟合到多项式函数中,以提供水平设置方法的生长速度。仿真显示了我们的模型预测<111>方向上的拐角和<100>方向上的驼峰形状的能力。最新论文的透射电子显微镜图片证实了这一点。由于硼在非晶硅和晶体硅中的扩散率不同(大约有五个数量级的差异),并且由于在夹角处形成的各种缺陷可能导致按比例缩放的器件中出现更高的泄漏电流,因此该模型引起了人们的特别关注。水平集模型是在FLOOPS中实现的。

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