Low-Cost Production of Large RBSC Components by Plastic Forming Processes

H.-W. Lee; H.-W. Jun; J. Kim; H. Song; J. Ha

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Low-Cost Production of Large RBSC Components by Plastic Forming Processes

机译：通过塑料成型工艺低成本生产大型RBSC组件

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Large-size RBSC components have been successfully fabricated in near-net-dimension by eliminating process shrinkages. Forming shrinkages were substantially decreased to negligible level by thermoset molding, while sintering shrinkage was almost completely eliminated by reaction infiltration. Powder-resin mixture with sufficient fluidity was used to form a radiant tube by powder transfer molding, while homogeneous granules in dry state were used to form a pile with multiple notches for a wafer carrier by powder compression molding. Green joining was employed to fabricate a wafer carrier by applying a rapidly curing paste between two end plates and four piles with multiple slots. Reaction infiltration was completed using a concept of contact infiltration which established planar contacts between the preform and reservoir with subdued liquid agglomeration.

机译：通过消除工艺收缩，已经成功地以接近净尺寸制造了大型RBSC组件。通过热固性成型，成型收缩率基本上降低到可以忽略的水平，而反应渗透几乎完全消除了烧结收缩率。具有足够流动性的粉末-树脂混合物用于通过粉末传递模塑法形成辐射管，而干燥状态下的均质颗粒用于通过粉末压缩模塑法形成用于晶片载体的具有多个凹口的堆。通过在两个端板和具有多个缝隙的四个桩之间施加快速固化的糊剂，采用生坯接合来制造晶片载体。反应渗透是利用接触渗透的概念完成的，该接触渗透在预成型坯和储层之间建立了平面接触，并产生了弱的液体聚集。

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《Key Engineering Materials》 |2003年第2003期|p.95-100|共6页
作者
H.-W. Lee; H.-W. Jun; J. Kim; H. Song; J. Ha;
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作者单位

Korea Institute of Science and Technology, P.O.Box 131, Cheongryang Seoul, Korea;

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原文格式 PDF
正文语种 eng
中图分类工程基础科学;
关键词
contact infiltration; near-net shaping; RBSC; thermoset molding;

机译：接触渗透;近净成形;RBSC;热固成型;

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Low-Cost Production of Large RBSC Components by Plastic Forming Processes

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