Low-Cost Production of Large RBSC Components by Plastic Forming Processes

机译：通过塑料形成工艺低成本生产大型RBSC组件

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Large-size RBSC components have been successfully fabricated in near-net-dimension by eliminating process shrinkages. Forming shrinkages were substantially decreased to negligible level by thermoset molding, while sintering shrinkage was almost completely eliminated by reaction infiltration. Powder-resin mixture with sufficient fluidity was used to form a radiant tube by powder transfer molding, while homogeneous granules in dry state were used to form a pile with multiple notches for a wafer carrier by powder compression molding. Green joining was employed to fabricate a wafer carrier by applying a rapidly curing paste between two end plates and four piles with multiple slots. Reaction infiltration was completed using a concept of contact infiltration which established planar contacts between the preform and reservoir with subdued liquid agglomeration.

机译：通过消除工艺收缩，已经在近净维度中成功地制造了大型RBSC组件。通过热固性成型，形成收缩基本上降低至可忽略的水平，而通过反应渗透几乎完全消除烧结收缩。使用足够的流动性的粉末树脂混合物通过粉末转移成型形成辐射管，而干燥状态的均匀颗粒用于通过粉末压缩模塑形成具有多个凹口的薄片的堆。采用绿色连接来制造晶片载体通过在两个端板之间的快速固化浆料和具有多个槽的四个桩之间进行制造。使用具有较低液体附聚的预制件和贮存器之间建立平面接触的接触渗透概念完成反应渗透。

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来源
《International Symposium on Advanced Ceramics》|2003年||共6页
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作者
H. -W. Lee; H. -W. Jun; J. Kim; H. Song; J. Ha;
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原文格式 PDF
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中图分类 TU5-532;
关键词
Contact Infiltration; Near-Net Shaping; RBSC; Thermoset Molding;

机译：接触渗透;近净成型;RBSC;热固性成型;

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4. Low-Cost Production of Large RBSC Components by Plastic Forming Processes [C] . H. -W. Lee, H. -W. Jun, J. Kim, International Symposium on Advanced Ceramics . 2003

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Low-Cost Production of Large RBSC Components by Plastic Forming Processes

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