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首页> 外文期刊>Materials Science and Engineering. A, Structural Materials: Properties, Microstructure and Processing >Recrystallization behaviour of SnAgCu solder joints
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Recrystallization behaviour of SnAgCu solder joints

机译：SnAgCu焊点的再结晶行为

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摘要

The recrystallization behaviour of tin in various SnAgCu solder joints, chip-scale packages (CSPs), 0402 resistors and single-overlap shear specimens was studied. The objective of the study was to determine the effect of solder composition (hypoeutectic, eutectic and hypereutectic SnAgCu), the surface finish of printed circuit board (PCB) and the type of the solder joints on the recrystallization of tin during thermomechanical fatigue and isothermal creep. The results show that after reflow the solder joints consist only of a few tin grains. During thermomechanical fatigue recrystallization nucleates at the locations where the strain is concentrated, i.e. in the neck region of CSP, in the solder between the 0402 resistor and PCB and in the vicinity of voids. The recrystallized grains facilitate the occurrence of intergranular fracture. The results indicate that solder joints with hypoeutectic composition have a tendency to recrystallize more readily than joints with eutectic or hypereutectic composition.
机译：研究了锡在各种SnAgCu焊点，芯片级封装（CSP），0402电阻器和单重剪切试样中的再结晶行为。该研究的目的是确定热机械疲劳和等温蠕变过程中焊料成分（亚共晶，共晶和过共晶SnAgCu），印刷电路板（PCB）的表面光洁度以及焊点类型对锡重结晶的影响。 。结果表明，回流后，焊点仅由少量锡晶粒组成。在热机械疲劳过程中，再结晶在应变集中的位置成核，即在CSP的颈部区域，0402电阻器和PCB之间的焊料中以及在空隙附近。重结晶的晶粒有助于晶间断裂的发生。结果表明，具有低共晶组成的焊点比具有低共熔或过共晶组成的焊点更容易重结晶。

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