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The growth behavior and stress evolution of sputtering-deposited LaNiO_3 thin films

机译:溅射沉积LaNiO_3薄膜的生长行为和应力演化

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LaNiO_3 (LNO) thin films were deposited on Si(100) substrates by ratio frequency (RF) magnetron sputtering. It was found that the stress evolution was directly related to the film morphology. At the early growth stage, the grain size and the orientation factor T_(100) increased rapidly below a critical thickness (about 100 nm), meanwhile the residual stress shows a compressive-tensile-compressive transition behavior associated with Volmer-Weber growth mode. With the films thickening, the columnar structure was developed, and simultaneously the compressive stress decreased gradually as a consequence of the grain growth. Finally, an additional influence of the thermal stress and hygroscopic extrinsic stress has also been taken into consideration.
机译:LaNiO_3(LNO)薄膜通过比率频率(RF)磁控溅射法沉积在Si(100)衬底上。发现应力演变与膜的形态直接相关。在早期生长阶段,在临界厚度(约100 nm)以下,晶粒尺寸和取向因子T_(100)迅速增加,同时残余应力表现出与Volmer-Weber生长模式相关的压缩-拉伸-压缩转变行为。随着膜的增厚,形成了柱状结构,同时由于晶粒的生长,压缩应力逐渐降低。最后,还考虑了热应力和吸湿外部应力的附加影响。

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