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首页> 外文期刊>Materials Science and Engineering. A, Structural Materials: Properties, Microstructure and Processing >Microstructural study of annealed gold-silicon thin films under nanoindentation
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Microstructural study of annealed gold-silicon thin films under nanoindentation

机译：纳米压痕退火金硅薄膜的微观结构研究

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摘要

The mechanical properties of as-deposited Au/Si thin films indented to depths of 1000 nm are measured using a nanoindentation technique. The microstructural evolution of the as-deposited indented specimens and specimens annealed at temperatures of 250, 350 and 450 ℃, respectively, are examined via transmission electron microscopy (TEM). The initial deposited thin film system is a composite structure consisting of a 500 nm Au thin film, a 5 nm Cr adhesive layer and a Si(100) substrate. The Au thin film has a polycrystalline structure, while both the Cr adhesive layer and the Si substrate have a single crystal state. The experimental nanoindentation results for the as-deposited specimens show that the loading curves are continuous and smooth. However, a pop-out feature is observed in the unloading curves. Furthermore, a pile-up of the thin film material is observed around the edges of the indentation. By contrast, a total recovery of the plastic zones in the indentation site takes place in the annealed specimens. TEM observations show that the microstructural evolution of the thin films within the indentation zone is strongly dependent on the annealing temperature. In the case of the as-deposited specimens, the indentation pressure induces a chain-like island structure and a distorted crystalline structure within the indentation zone. However, in the specimens annealed at temperatures of 250 and 350 ℃, respectively, the microstructure of the indentation zone changes from a distorted crystalline structure to an amorphous phase as a result of the plastic deformation induced during indentation. The pop-out event observed in the unloading curve of the as-deposited specimens is also thought to be related to a similar amorphous transformation. At an annealing temperature of 450 ℃, the microstructure contains both amorphous phase and crystalline eutectic phase. The formation of eutectic phase is the result of a higher annealing temperature and a greater indentation deformation.
机译：使用纳米压痕技术测量压入1000nm深度的沉积的Au / Si薄膜的机械性能。通过透射电子显微镜（TEM）观察了沉积后的压痕试样和分别在250、350和450℃退火的试样的显微组织演变。最初的沉积薄膜系统是由500 nm Au薄膜，5 nm Cr粘合剂层和Si（100）衬底组成的复合结构。 Au薄膜具有多晶结构，而Cr粘合剂层和Si衬底均具有单晶态。沉积样品的纳米压痕实验结果表明，加载曲线是连续且平滑的。但是，在卸载曲线中观察到弹出特征。此外，在凹痕的边缘周围观察到薄膜材料的堆积。相反，在退火试样中，压痕部位的塑性区完全恢复。 TEM观察表明，在压痕区内的薄膜的微观结构演变很大程度上取决于退火温度。在沉积样品的情况下，压痕压力会在压痕区内诱发链状岛状结构和扭曲的晶体结构。然而，在分别于250和350℃的温度下退火的试样中，由于压痕过程中引起的塑性变形，压痕区的微观结构从扭曲的晶体结构变为非晶相。在沉积样品的卸载曲线中观察到的弹出事件也被认为与类似的无定形转化有关。在450℃的退火温度下，显微组织既包含非晶相又包含结晶共晶相。共晶相的形成是较高的退火温度和较大的压痕变形的结果。

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