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Fabrication of submicron photon sieve using E-beam lithography and X-ray lithography

机译:使用电子束光刻和X射线光刻技术制造亚微米光子筛

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摘要

In this paper, a new hybrid method to fabricate submicron photon sieve is proposed, where the E-beam lithography and the X-ray lithography are used. It is found that 2.8 μm thickness of the polyimide film, 400 nm thickness of the ZEP-520 and 280 μC/cm~2 exposure dose are good for E-beam lithography, while 500 nm thickness of the PMMA and 30 s developing time are good for X-ray lithography. We have successfully fabricated the photon sieve with these parameters (the diameter of photon sieve: 250 μm, the focal length: 150 μm, the diameter of the outmost pinhole: 420 nm). Some key techniques of this method are analyzed respectively, and the error analysis are done at the end of this paper. It provides a direction of nanoscale optical element fabrication with higher resolution and lower cost.
机译:本文提出了一种利用电子束光刻和X射线光刻技术制备亚微米光子筛的新方法。发现聚酰亚胺薄膜的厚度为2.8μm,ZEP-520的厚度为400 nm,曝光剂量为280μC/ cm〜2适于电子束光刻,而PMMA的厚度为500 nm和显影时间为30 s。适用于X射线光刻。我们已经成功地用这些参数制造了光子筛(光子筛的直径:250μm,焦距:150μm,最外面的针孔的直径:420 nm)。分别分析了该方法的一些关键技术,并在本文的最后进行了误差分析。它为高分辨率和低成本的纳米光学元件制造提供了方向。

著录项

  • 来源
    《Microelectronic Engineering》 |2011年第10期|p.3178-3181|共4页
  • 作者单位

    School of Electrical and Information Engineering, Xihua University, Chengdu 610039, China ,Key Laboratory of Signal and Information Processing of Sichuan Province, Xihua University, Chengdu 610039, China;

    Institute of Optics & Electronics, Chinese Academy of Sciences, Chengdu 610209, China;

    Institute of Microelectronics, Chinese Academy of Sciences, Beijing 100029, China;

    Institute of Microelectronics, Chinese Academy of Sciences, Beijing 100029, China;

    Institute of Optics & Electronics, Chinese Academy of Sciences, Chengdu 610209, China;

    School of Electrical and Information Engineering, Xihua University, Chengdu 610039, China ,Key Laboratory of Signal and Information Processing of Sichuan Province, Xihua University, Chengdu 610039, China;

    School of Electrical and Information Engineering, Xihua University, Chengdu 610039, China ,Key Laboratory of Signal and Information Processing of Sichuan Province, Xihua University, Chengdu 610039, China;

    School of Electrical and Information Engineering, Xihua University, Chengdu 610039, China ,Key Laboratory of Signal and Information Processing of Sichuan Province, Xihua University, Chengdu 610039, China;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    submicron photon sieve; e-beam lithography; x-ray lithography; key technique; error analysis;

    机译:亚微米光子筛;电子束光刻;X射线光刻;关键技术错误分析;

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