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首页> 外文期刊>Microelectronics & Reliability >Drop impact reliability of Sn-l.0Ag-0.5Cu BGA interconnects with different mounting methods
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Drop impact reliability of Sn-l.0Ag-0.5Cu BGA interconnects with different mounting methods

机译：不同安装方法的Sn-1.Ag-0.5Cu BGA互连的跌落冲击可靠性

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摘要

The poor drop-shock resistance of near-eutectic Sn-Ag-Cu (SAC) solder interconnects drives the research and application low-Ag SAC solder alloys, especially for Sn-l.0Ag-0.5Cu (SAC105). In this work, by dynamic four-point bend testing, we investigate the drop impact reliability of SAC105 alloy ball grid array (BGA) interconnects with two different surface mounting methods: near-eutectic solder paste printing and flux dipping. The results indicate that the flux dipping method improves the interconnects failure strain by 44.7% over paste printing. Further mechanism studies show the fine interfacial intermetallic compounds (IMCs) at the printed circuit board side and a reduced Ag content inside solder bulk are the main beneficial factors overcoming other negative factors. The flux dipping SAC105 BGA solder joints possess fine Cu_6Sn_5 IMCs at the interface of solder/Cu pads, which increases the bonding strength between the solder/IMCs and the fracture resistance of the IMC grains themselves. Short soldering time of flux dipping joints above the solder alloy liquidus mitigates the growth of interfacial IMCs in size. In addition, a reduced Ag content in flux dipping joint bulk causes a low hardness and high compliance, thus increasing fracture resistance under higher-strain rate conditions.
机译：接近共晶的Sn-Ag-Cu（SAC）焊料互连的耐摔落性差，推动了低Ag SAC焊料合金的研究和应用，特别是对于Sn-1.Ag-0.5Cu（SAC105）。在这项工作中，通过动态四点弯曲测试，我们研究了SAC105合金球栅阵列（BGA）互连件具有两种不同的表面贴装方法：近共晶锡膏印刷和助焊剂浸入的跌落冲击可靠性。结果表明，与浸膏印刷相比，助焊剂浸渍法将互连故障应变提高了44.7％。进一步的机理研究表明，印刷电路板侧的精细界面金属间化合物（IMC）以及焊锡块内部Ag含量降低是克服其他不利因素的主要有益因素。助焊剂浸渍SAC105 BGA焊点在焊料/铜垫的界面处具有精细的Cu_6Sn_5 IMC，从而提高了焊料/ IMC之间的结合强度以及IMC晶粒本身的抗断裂性。焊料合金液相线上方的助焊剂浸入接头的短焊接时间可减轻界面IMC尺寸的增长。此外，焊剂浸入焊缝中的Ag含量降低会导致硬度低和柔韧性高，从而在较高应变速率条件下提高抗断裂性。

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  • 来源
    《Microelectronics & Reliability》 |2012年第7期|p.1475-1482|共8页
  • 作者

    Bo Wang; Jiajun Li; Anthony Gallagher; James Wrezel; Pongpinit Towashirporn; Naiqin Zhao;

  • 作者单位

    School of Materials Science & Engineering, Tianjin University, Tianjin 300072, PR China Motorola Mobility Technologies Co. Ltd., Tianjin 300457, PR China;

    School of Materials Science & Engineering, Tianjin University, Tianjin 300072, PR China;

    Motorola Inc., Libertyville, IL 60048, USA;

    Motorola Inc., Libertyville, IL 60048, USA;

    Motorola Inc., Libertyville, IL 60048, USA;

    School of Materials Science & Engineering, Tianjin University, Tianjin 300072, PR China;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);
  • 原文格式 PDF
  • 正文语种 eng
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