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Comparison of Laser Processes for Microvia Formation in RCF, FR-4, and 'Thermount'

机译：比较在RCF，FR-4和'Thermount'中形成微孔的激光工艺

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The 532 nm laser has the potential to become the process-of-choice based on accuracy, throughput, and feasibility. The accuracy is equivalent to the UV laser, yet the power will permit the laser to compete against available CO_2 systems. Etch/CO_2 processes reach capability limits at 100 μm. Green laser drilling has drawbacks in terms of versatility. The process is qualified only for conventional "Ther-mount" and enhanced "Turbo" materials. By contrast, UV/UV and UV/CO_2 processes are qualified to process all materials in production today. In terms of accuracy, these techniques show little variance, because they depend on the UV to make the conformal mask. Thus, the main differentiating factor for the materials tested is the throughput of the green system. The combination of a lower variable cost, greater up-time, and fewer consumable items can reduce actual manufacturing costs by as much as 300%. The study with Polyclad and DDi has clearly demonstrated that the green laser has a higher throughput.
机译：532 nm激光有可能成为基于精度，吞吐量和可行性的首选工艺。精度与UV激光相当，但是功率将使该激光与现有的CO_2系统竞争。蚀刻/ CO_2工艺达到100μm的能力极限。绿色激光钻孔在通用性方面存在缺陷。该工艺仅适用于常规“热安装”和增强型“ Turbo”材料。相比之下，UV / UV和UV / CO_2工艺有资格加工当今生产中的所有材料。在准确性方面，这些技术几乎没有差异，因为它们依赖于紫外线来制作保形罩。因此，测试材料的主要区别因素是绿色系统的生产能力。较低的可变成本，较长的正常运行时间和较少的耗材组合在一起可以使实际制造成本降低多达300％。与Polyclad和DDi进行的研究清楚地表明，绿色激光器具有更高的吞吐量。

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