Interconnect and substrate modeling and analysis: an overview

Chiprout E.

首页> 外文期刊>IEEE Journal of Solid-State Circuits >Interconnect and substrate modeling and analysis: an overview

【24h】

Interconnect and substrate modeling and analysis: an overview

机译：互连和基板建模与分析：概述

获取原文

获取原文并翻译 | 示例

掌桥外文数据库（机构版） >>

开具论文收录证明 >>

文献代查 >>

页面导航

摘要
著录项
相似文献
相关主题

摘要

Accurate models for on-chip metal interconnect, silicon substrate,nand packaging have become necessary for accurate simulation ofnhigh-performance ULSI circuits and high-speed RF designs. An overview ofnthe hierarchy of techniques used to model and simulate these structuresnis given. While not an exhaustive summary, the purpose of the paper isnto give the designer fundamental and practical understanding ofnprinciples used in modeling and analysis. The range of techniques fromnthree-dimensional (3-D) modeling to quasi-3-D to transmission lines arenanalyzed, and their importance and impact are described. A modelingnstrategy that can include various kinds of modeling techniques andnnonlinear devices in one simulation is also described

机译：芯片上金属互连，硅衬底，封装的精确模型对于高性能ULSI电路和高速RF设计的精确仿真已成为必需。给出了用于对这些结构进行建模和仿真的技术层次的概述。尽管不是详尽的总结，但本文的目的是使设计人员对建模和分析中使用的原理有基本的和实际的了解。分析了从三维（3-D）建模到准3-D到传输线的技术范围，并描述了它们的重要性和影响。还描述了一种可以在一次仿真中包含各种建模技术和非线性设备的建模策略

著录项

来源
《IEEE Journal of Solid-State Circuits》 |1998年第9期|p.1445-1452|共8页
作者
Chiprout E.;
展开▼
作者单位

展开▼
收录信息美国《科学引文索引》(SCI);美国《工程索引》(EI);
原文格式 PDF
正文语种 eng
中图分类一般性问题;基本电子电路;
关键词
Maxwell equations; UHF integrated circuits; ULSI; equivalent circuits; integrated circuit interconnections; integrated circuit modelling; reviews; substrates; transmission line theory; 3D modeling; Si substrate; ULSI circuits; high-speed RF designs; interconnect mode;

机译：Maxwell方程;UHF集成电路;ULSI;等效电路;集成电路互连;集成电路建模;综述;基板;传输线理论;3D建模;Si基板;ULSI电路;高速RF设计;互连模式;

相似文献

外文文献
中文文献
专利

1. Interconnect and substrate modeling and analysis: an overview [J] . Chiprout E. IEEE Journal of Solid-State Circuits . 1998,第9期

机译：互连和基板建模与分析：概述
2. Non-planar interconnects in double-sided flexible Cu-PET substrates using a laser-assisted maskless microdeposition process: 3D finite element modeling and experimental analysis [J] . Elahe Jabari, Steven Tong, Amir Azhari, Optics and Lasers in Engineering . 2014,第mara期

机译：使用激光辅助的无掩模微沉积工艺在双面柔性Cu-PET基板中进行非平面互连：3D有限元建模和实验分析
3. Modeling and analysis of nonuniform substrate temperature effects on global ULSI interconnects [J] . Ajami A.H., Banerjee K., Pedram M. IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems . 2005,第6期

机译：全局ULSI互连上基板温度不均匀影响的建模和分析
4. Interconnect and substrate modeling and analysis: an overview [C] . Chiprout, E. . 1997

机译：互连和基板建模与分析：概述
5. Effects of non-uniform substrate temperature in high-performance integrated circuits: Modeling, analysis, and implications for signal integrity and interconnect performance optimization. [D] . Ajami, Amir Hooshang. 2003

机译：高性能集成电路中基板温度不均匀的影响：建模，分析以及对信号完整性和互连性能优化的影响。
6. An Effective Lift-Off Method for Patterning High-Density Gold Interconnects on an Elastomeric Substrate [O] . Liang Guo, Prof. Stephen P. DeWeerth -1

机译：一种有效的剥离方法用于在弹性体基材上进行图案化的高密度金互连
7. Modeling and analysis of nonuniform substrate temperature effects on global ULSI interconnects [O] . Amir H. Ajami, Kaustav Banerjee, Senior Member, 2005

机译：全局ULSI互连上基板温度不均匀影响的建模和分析

Interconnect and substrate modeling and analysis: an overview

摘要

著录项

相似文献

相关主题

期刊订阅