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首页> 外文期刊>Solid-State Electronics >Evaluation of triple-gate FinFETs with SiO_2-HfO_2-TiN gate stack under analog operation
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Evaluation of triple-gate FinFETs with SiO_2-HfO_2-TiN gate stack under analog operation

机译:SiO_2-HfO_2-TiN栅堆叠的三栅FinFET在模拟操作下的评估

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摘要

This work presents the analog performance of nMOS triple-gate FinFETs with high-K dielectrics, TiN gate material and undoped body from DC measurements. Different fin widths and devices with and without halo implantation are explored. No halo FinFETs can achieve extremely large gain and improved unity gain frequency at similar channel length than halo counterparts. The FinFETs with 110 nm long channel achieve an intrinsic gain of 25 dB. Extremely large Early voltages have been measured on long channel nMOS with no halo and relatively wide fins compared to the results usually reported in the literature. The large Early voltage obtained suggests that the devices operate in the onset of volume inversion due to the low doping level of the device body.
机译:这项工作展示了具有高K电介质,TiN栅极材料和直流测量的无掺杂主体的nMOS三栅极FinFET的模拟性能。探索了不同的鳍片宽度和有无光晕植入的器件。没有任何一个光环FinFET可以在比相同光环长度更长的通道长度上实现极大的增益并提高单位增益频率。具有110 nm长沟道的FinFET的固有增益为25 dB。与文献中通常报道的结果相比,在长通道nMOS上测量了非常大的早期电压,没有光晕且鳍片相对较宽。由于器件主体的低掺杂水平,获得的较大的早期电压表明该器件在体积反转开始时工作。

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