An ultrasonic laser sonar technique for copper damascene CMP metrology

Michael Colgan; Chris Morath; Guray Tas; Malcolm Grief

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An ultrasonic laser sonar technique for copper damascene CMP metrology

机译：铜镶嵌CMP化学计量的超声激光声纳技术

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摘要

The picosecond sonar technique has proven to be a powerful tool for process development and production process monitoring for copper dual damascene fabrication. Along with demonstrated capability to measure seed, barrier, and electroplated copper, the technique can be used to monitor CMP process control parameters.

机译：皮秒声纳技术已被证明是用于铜双大马士革制造过程开发和生产过程监控的强大工具。除了具有证明的测量种子，势垒和电镀铜的功能外，该技术还可用于监视CMP过程控制参数。

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来源
《Solid state technology》 |2001年第2期|p.6771-7274|共4页
作者
Michael Colgan; Chris Morath; Guray Tas; Malcolm Grief;
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收录信息美国《科学引文索引》(SCI);美国《工程索引》(EI);
原文格式 PDF
正文语种 eng
中图分类一般性问题;
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专利

1. Investigating CMP and post-CMP cleaning issues for dual-damascene copper technology [J] . Maria L. Peterson, Robert J. Small, Gordon A. Shaw III, Micro . 1999,第1期

机译：研究双大马士革铜技术的CMP和CMP后清洁问题
2. Copper damascene electroplating for efficient CMP [J] . European Semiconductor . 2004,第6期

机译：铜镶嵌电镀可实现高效CMP
3. Modeling CMP for copper dual damascene interconnects [J] . Lin Yang Solid state technology . 2000,第6期

机译：铜双镶嵌互连的CMP建模
4. In-line Monitoring of Advanced Copper CMP Processes with Picosecond Ultrasonic Metrology [C] . Ming Hsun Hsieh, J. H. Yeh, Mingsheng Tsai, Metrology, Inspection, and Process Control for Microlithography XX pt.2 . 2006

机译：使用皮秒超声计量学对高级铜CMP工艺进行在线监测
5. Kinetic study of copper chemistry in chemical mechanical polishing (CMP) by an in-situ real time measurement technique. [D] . Choi, Changhoon. 2008

机译：通过现场实时测量技术对化学机械抛光（CMP）中的铜化学动力学进行研究。
6. Comparison of the efficacy of laser-activated and ultrasonic-activated techniques for the removal of tricalcium silicate-based sealers and gutta-percha in root canal retreatment: a microtomography and scanning electron microscopy study [O] . Ruiqi Yang, Yuqing Han, Zhaohui Liu, 2021

机译：激光激活和超声波活化技术的疗效与根管撤退中硅酸钙的硅酸钙的密封剂和静脉凝固术的疗效进行比较：MICROROMACTOM和扫描电子显微镜研究
7. Metrology Tool for Microstructure Control on 300 mm Wafers During Damascene Copper Processing [O] . K. J. Kozaczek 2003

机译：镶嵌铜加工300毫米晶圆上的微观结构控制的计量工具

An ultrasonic laser sonar technique for copper damascene CMP metrology

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