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首页> 外文期刊>Physical Review, B. Condensed Matter >REDOX MECHANISM FOR THE GENERATION OF HOLES IN TLBA1-XSRXLACUO5+DELTA - A NEUTRON-DIFFRACTION STUDY
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REDOX MECHANISM FOR THE GENERATION OF HOLES IN TLBA1-XSRXLACUO5+DELTA - A NEUTRON-DIFFRACTION STUDY

机译：TLBA1-XSRXLACUO5 + DELTA中孔生成的氧化还原机理-中子衍射研究

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Our neutron-diffraction study of the single T1-O layered T1Ba(1) (-) xSrxLaCuO5 (+) (delta) system (x = 0.0, 0.4, 0.7, and 1.0) shows that the in-plane Cu-O(2) bond length decreases monotonically with increase of x. This is consistent with the introduction of holes in CuO2 layers or the appearance of superconductivity in the sample with x = 0.4 (T-c = 22 K) and increase of T-c with x, T-c = 25 and 30 K for samples with x = 0.7 and 1.0, respectively. Further, the valence of copper, derived from Cu-O bond length, increases with increase of x despite the fact that the O content decreases as x increases. This clearly suggests that the internal redox mechanism due to the overlap of the empty T1 6s band with the filled Cu 3d(x2-y2) band is responsible for the generation of holes, and therefore superconductivity, in these materials. [References: 20]
机译：我们对单个T1-O层状T1Ba（1）（-）xSrxLaCuO5（+）δ系统（x = 0.0、0.4、0.7和1.0）的中子衍射研究表明，面内Cu-O（2 ）键长随x的增加单调减少。这与在x = 0.4（Tc = 22 K）的样品中引入CuO2层中的孔或出现超导性以及x x = 0.7和1.0的样品中x的Tc随x，Tc = 25和30 K的增加而一致。 ， 分别。此外，尽管O含量随x的增加而降低，但源自Cu-O键长的铜的价数随x的增加而增加。这清楚地表明，由于空的T1 6s带与填充的Cu 3d（x2-y2）带的重叠而引起的内部氧化还原机制是这些材料中空穴的产生和超导的原因。 [参考：20]

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