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首页> 外文期刊>Practical Metallography >Materials Processing by Focused Ion Beams for TEM Sample Preparation and Nanostructuring
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Materials Processing by Focused Ion Beams for TEM Sample Preparation and Nanostructuring

机译：聚焦离子束对TEM样品制备和纳米结构的材料处理

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摘要

Focused ion beam processing allows controlled and well defined material removal. It has, therefore, emerged as a major method for TEM lamella preparation, especially when local cross sectioning is necessary. But the interaction of ions with the sample leads to parasitic effects which have to be minimized or parasitic effects which have to be minimized or taken into consideration. The most critical issue is the damage created to all areas exposed to the ion beam, even during alignment. Therefore, it is necessary to protect sensitive areas, like surface of the structure to be analyzed by a protective layer. Side wall damage may be minimized by lowering ion energy, but up to now, this is possible only in limited way. For almost damage free fine structuring of the TEM lamella, ion energies below 1 keV would be advisable, which are up to now not available in strong focusing ion beam columns.
机译：聚焦离子束处理可实现受控且定义明确的材料去除。因此，它已成为制备TEM薄片的主要方法，特别是在需要局部剖切的情况下。但是离子与样品的相互作用导致必须将寄生效应最小化或将寄生效应最小化或考虑在内。最关键的问题是即使在对准过程中，所有暴露于离子束的区域也会造成损坏。因此，有必要通过保护层来保护敏感区域，例如待分析结构的表面。降低离子能量可以最大程度地减少侧壁损坏，但到目前为止，这只能以有限的方式实现。对于TEM薄片几乎无损的精细结构，建议低于1 keV的离子能量，到目前为止，在强聚焦离子束柱中尚不可用。

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