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首页> 外文期刊>Carbohydrate Polymers: Scientific and Technological Aspects of Industrially Important Polysaccharides >Evaluation of the mechanical damage on wheat starch granules by SEM, ESEM, AFM and texture image analysis
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Evaluation of the mechanical damage on wheat starch granules by SEM, ESEM, AFM and texture image analysis

机译：SEM，ESEM，AFM和纹理图像分析评估小麦淀粉颗粒的机械损伤

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摘要

The effect of mechanical damage on wheat starch granules surface, at a microstructural level, was investigated by scanning electron microscopy (SEM), environmental scanning electron microscopy (ESEM), atomic force microscopy (AFM), and image textural analysis. The SEM and ESEM images of the native sample showed that the starch granules had smooth, flat surfaces and smooth edges. The samples with higher damaged starch content exhibited granular distortion, irregularity and less uniformity. The fractal dimension of contour parameter increased with mechanical damage, indicating that the surface irregularities quantitatively increased due to the damage. The surfaces of damaged granules showed depressions of different shapes and sizes. The roughness parameters and fractal dimension of the surface increased as a result of the mechanical damage. The surface of damaged granules showed higher entropy and lower homogeneity values when damaged starch increased. The results indicated that the mechanical process caused structural modifications at nano level.
机译：在微观结构水平上，通过扫描电子显微镜（SEM），环境扫描电子显微镜（ESEM），原子力显微镜（AFM）和图像纹理分析研究了机械损伤对小麦淀粉颗粒表面的影响。天然样品的SEM和ESEM图像显示淀粉颗粒具有光滑，平坦的表面和光滑的边缘。受损淀粉含量较高的样品表现出颗粒变形，不规则性和均一性较低。轮廓参数的分形维数随着机械损伤的增加而增加，表明表面不规则性由于损伤而定量增加。受损颗粒的表面显示出不同形状和大小的凹陷。由于机械损伤，表面的粗糙度参数和分形维数增加。当受损淀粉增加时，受损颗粒的表面表现出较高的熵和较低的均一性值。结果表明，机械过程导致了纳米级的结构修饰。

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