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首页> 外文期刊>Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics >Effects of intermetallic compounds on properties of Sn-Ag-Cu lead-free soldered joints
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Effects of intermetallic compounds on properties of Sn-Ag-Cu lead-free soldered joints

机译：金属间化合物对Sn-Ag-Cu无铅焊点性能的影响

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摘要

The effects of alloy composition on microstructural, especially the formation of large intermetallic compounds, and mechanical properties of various Sn-Ag-Cu solder joints were investigated. The range of Ag-Cu content of Sn-Ag-Cu alloys was from 3.0 wt. percent Ag-0.5 wt. percent Cu to 3.9Ag-0.7 wt. percent Cu. The high Ag content alloys exhibit the formation of large Ag_3 Sn platelets especially at the solder-reaction layer interfaces, regardless of the kind of substrates. Long Cu_6Sn_5 whiskers are formed in all the solder-Cu joints and the high Cu content solder joints. Those whiskers have two shapes of needle and of hollow types. For the high Cu content solder joints with a 42 alloy substrate, long Ni-Cu-Sn whiskers are also formed at the interface and in the solder. The presence of large Ag_3Sn platelets does not degrade strength directly, but affects fracture mode. Large Ag_3Sn platelets induce brittle fracture at an interface and provide crack initiation sites. In order to avoid the formation of the large intermetallic compounds, especially Ag_3 Sn platelets, the optimum composition of Sn-Ag-Cu alloy lies in the lower Ag-Cu content.
机译：研究了合金成分对微观结构，尤其是大型金属间化合物的形成以及各种Sn-Ag-Cu焊点力学性能的影响。 Sn-Ag-Cu合金的Ag-Cu含量范围为3.0重量％。 Ag-0.5重量％铜的百分比为3.9Ag-0.7 wt。铜百分比高Ag含量的合金尤其在焊料反应层界面处表现出大的Ag_3Sn小片的形成，而与衬底的种类无关。在所有的焊料铜接头和高铜含量的焊料接头中都形成了长的Cu_6Sn_5晶须。那些晶须具有针状和中空状两种形状。对于具有42合金基底的高Cu含量焊点，在界面和焊料中还会形成长的Ni-Cu-Sn晶须。较大的Ag_3Sn血小板的存在不会直接降低强度，但会影响断裂模式。大的Ag_3Sn血小板在界面处引起脆性断裂并提供裂纹萌生位置。为了避免形成较大的金属间化合物，特别是Ag_3 Sn片晶，Sn-Ag-Cu合金的最佳组成在于较低的Ag-Cu含量。

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