...
首页> 外文期刊>Journal of Mechanical Science and Technology >Prediction enhancement of the J-lead interconnection reliability of land grid array sockets
【24h】

Prediction enhancement of the J-lead interconnection reliability of land grid array sockets

机译:预测提高陆地网格阵列插座的J引线互连可靠性

获取原文
获取原文并翻译 | 示例
           

摘要

The solder joint is a key component in land grid array (LGA) sockets. A simplified solder joint has been widely used in finite element model (FEM) computations because the J-lead interconnection solder joint is relatively complex. Therefore, there are discrepancies between the physical phenomenon and FEM simulations. In this study, an alternative method to simulate the J-lead interconnection solder joint through an interface program using surface evolver software is presented. Simulations of the J-lead interconnection solder joint were improved to reduce the mismatch between the actual physical shape and the simplified finite element models that are typically used to predict component reliability. To perform these simulations, an interface program capable of simulating solder interconnections for twelve different pad-solder combinations was developed. Predictions of J-lead interconnection solder joints were carried out using the interface program. Geometric comparisons between experimental data and predictions showed good agreement, with the exception of wetting height. To evaluate the prediction accuracy of the simulated J-lead solder joints, FEM analysis was performed for the static load and the thermal cycle.
机译:焊点是焊盘阵列(LGA)插座中的关键组件。简化的焊点已广泛用于有限元模型(FEM)计算中,因为J引线互连焊点相对复杂。因此,物理现象与有限元模拟之间存在差异。在这项研究中,提出了一种使用表面进化软件通过接口程序模拟J引线互连焊点的替代方法。改进了J引线互连焊点的仿真,以减少实际物理形状与通常用于预测组件可靠性的简化有限元模型之间的不匹配。为了执行这些模拟,开发了一个接口程序,该程序可以模拟十二种不同焊盘-焊料组合的焊料互连。使用接口程序对J引线互连焊点进行了预测。实验数据和预测结果之间的几何比较显示出很好的一致性,但润湿高度除外。为了评估模拟J铅焊点的预测精度,对静载荷和热循环进行了FEM分析。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号