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首页> 外文期刊>Journal of Materials Engineering and Performance >Infrared Heat Treatment of Ti-6Al-4V With Electroplated Cu
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Infrared Heat Treatment of Ti-6Al-4V With Electroplated Cu

机译：电镀铜的红外热处理Ti-6Al-4V

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The objective of this study is to investigate an innovative infrared (IR) technique to enhance adhesion of electroplated copper (Cu) on TJ-6A1-4V without dichromate dipping. The ultimate goal is to develop a Cu coating process on TS-6A1-4V without hazardous hexavalent chromium (Cr) solution treatments. Cu coatings of around 50 um were electroplated on T1-6A1-4V specimens at a current density of 0.03 A/cm~2 in an acidic Cu solution. To improve adhesion of coatings, IR heat treatments were performed on the Cu-coated samples at different temperatures and durations: 860 deg C for 600 s and 875 deg C for 20-120 s. This process was accomplished in an attempt to replace the use of dichromate dipping before electroplating. For samples heat treated at 860 deg C, no bonding existed, even after 600 s. It is believed that solid-state diffusion prevailed at 860 deg C and that 600 s was not enough for sufficient diffusion to occur. Adhesion was poor when samples were heat treated at 875 deg C for 20 s. Excellent adhesion was observed when the heat treatment holding time was increased to 40 s. For 90 s, the surface appearance of coatings partially changed from Cu-colored to a grayish color. There was no Cu left on the surface after a 120 s heat treatment. From optical microscopic observations on sample cross sections, an interlayer between the Cu and Ti-6Al-4V formed when heat treated at 875 deg C for 40 s and longer. The interlayer thickness increased as the holding time increased, until depletion of Cu. The sheet resistivity of coated specimens was on the order of pure Cu for samples heat treated at 875 deg C and less than 90 s. During the 875 deg C heat treatment, the following occurred: solid-state diffusion of Cu in TI-6A1-4V, formation of eutectic solutions, dissolution of Cu and TJ-6A1-4V into the liquid phase, and the formation of intermetallic compounds. The lowest eutectic temperature of 875 deg C played a key role in this innovative process of Cu coating on TS-6A1-4V.
机译：这项研究的目的是研究一种创新的红外（IR）技术，以提高电镀铜（Cu）在TJ-6A1-4V上的附着力而无需重铬酸盐浸渍。最终目标是开发一种在TS-6A1-4V上进行无有害六价铬（Cr）溶液处理的Cu涂层工艺。在酸性Cu溶液中，以0.03 A / cm〜2的电流密度在T1-6A1-4V样品上电镀约50 um的Cu涂层。为了提高涂层的附着力，在860℃下持续600 s和875℃下持续20-120 s的不同温度和持续时间对涂有Cu的样品进行了IR热处理。完成该过程是为了尝试在电镀之前代替重铬酸盐浸渍。对于在860℃热处理的样品，即使在600 s之后也没有结合。据信固态扩散在860℃占主导，并且600s不足以发生足够的扩散。当样品在875摄氏度下热处理20 s时，附着力很差。当热处理保持时间增加到40 s时，观察到了极好的附着力。在90 s的时间内，涂层的表面外观从铜色部分变为浅灰色。 120秒钟的热处理后，表面没有铜残留。从样品横截面的光学显微镜观察，当在875℃下热处理40 s或更长时间时，会在Cu和Ti-6Al-4V之间形成中间层。夹层厚度随着保持时间的增加而增加，直到耗尽铜​​为止。对于在875摄氏度和小于90 s热处理的样品，涂层样品的薄层电阻率为纯Cu量级。在875摄氏度的热处理过程中，发生了以下事情：Cu在TI-6A1-4V中的固态扩散，低共熔溶液的形成，Cu和TJ-6A1-4V在液相中的溶解以及金属间化合物的形成。共晶最低温度875摄氏度在TS-6A1-4V的这种创新的Cu涂层工艺中发挥了关键作用。

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