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首页> 外文期刊>Journal of Materials Engineering and Performance >Positron Annihilation Spectroscopy in the Evaluation of Microstructure of Cast Copper and Copper-Aluminum Alloys during Isochronal Annealing
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Positron Annihilation Spectroscopy in the Evaluation of Microstructure of Cast Copper and Copper-Aluminum Alloys during Isochronal Annealing

机译：正电子ni没光谱法用于等时退火过程中铸铜和铜铝合金铸件微观结构的评估

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Isochronal annealing was carried out for cast-Cu, Cu-5wt. percent AI, Cu-10wt. percent Al, and Cu-20wt. percent Al alloys in the range of 423-1173 K. The annealing behavior was followed by positron annihilation lifetime spec-troscopy (PALS). Microhardness (ffv) has been measured and used for comparison. The microstructure variations were observed by optical and scanning electron microscopy. Three stages were distinguished for all samples in the behavior of average lifetime (tau_(av)) and H_v. In the first stage (room temperature to 573 K), tau_(av) and H_v reach extremely high values for Cu-20wt. percent Al compared with other alloys. The analysis of the first stage indicates anneal softening for cast Cu and Cu-5wt. percent Al and anneal hardening for Cu-10wt. percent Al and Cu-20wt. percent Al. The second stage (573-873 K) is characterized by a maximum of tau_(av) at 673 K followed by a decrease up to the end of the stage for cast Cu, Cu-5wt. percent Al (the highest maximum), and Cu-10wt. percent Al; a slight change is observed for Cu-20wt. percent Al. The change in H_v is notable only for Cu-10wt. percent Al and Cu-20wt. percent Al, and indicates that T_(av) is sensitive to the change that occurred in the bulk material, while H_v shows the general behavior of the surface of the material. The third stage (873-1173 K) is characterized by near saturation for both T_(av) and H_v, indicating complete recrystallization for cast Cu, Cu-5wt. percent Al, and Cu-10wt. percent Al and complete softening for Cu-20wt. percent Al. Recrystallization is shifted to higher temperatures by increasing the amount of Al in Cu. The analysis of positron lifetime presents evidence of the existence of three-dimensional (3D) defects in addition to one-dimensional defects, so a modification to the simple trapping model is needed when considering inhomogeneous trapping.
机译：对铸铜Cu-5wt进行了等时退火。百分比AI，Cu-10wt。百分比的Al和Cu-20wt。百分比的合金在423-1173 K范围内。退火行为之后是正电子an没寿命光谱（PALS）。已测量了显微硬度（ffv），并将其用于比较。通过光学和扫描电子显微镜观察微观结构变化。对于所有样本，其平均寿命（tau_（av））和H_v的行为分为三个阶段。在第一阶段（室温到573 K），tau_（av）和H_v对于Cu-20wt达到极高的值。与其他合金相比，铝含量低。第一阶段的分析表明铸造的Cu和Cu-5wt的退火软化。百分比的Al和Cu-10wt的退火硬化。 Al和Cu-20wt％。铝百分比第二阶段（573-873 K）的特征是tau_（av）在673 K处最大，然后下降直至铸造Cu，Cu-5wt的阶段结束。 Al（最高含量）和Cu-10wt。％。铝百分比对于Cu-20wt，观察到轻微变化。铝百分比H_v的变化仅对于Cu-10wt才显着。 Al和Cu-20wt％。百分比表示Al，并表示T_（av）对散装材料中发生的变化敏感，而H_v显示了材料表面的一般行为。第三阶段（873-1173 K）的特征是T_（av）和H_v都接近饱和，表明铸造的Cu，Cu-5wt完全重结晶。百分比的Al和Cu-10wt。百分比的铝和完全软化的Cu-20wt。铝百分比通过增加Cu中的Al含量，可将重结晶移至更高的温度。正电子寿命的分析提供了除了一维缺陷外还存在三维（3D）缺陷的证据，因此在考虑不均匀捕获时，需要对简单捕获模型进行修改。

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