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Formation of source and drain of a-Si : H TFT by ion implantation through metal technique

机译:金属技术离子注入形成a-Si:H TFT的源漏。

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摘要

Ion implantation through metal technique (ITM) has been applied to form source and drain regions of hydrogenated amorphous silicon thin film transistors (a-Si:H TFTs) with an inverted staggered electrode structure. The metallic drain and source electrodes were used as scattering layers. Ten nanometers thickness of drain and source metallization molybdenum and titanium have been successfully selected to fabricate TFTs with good performance. The ON-OFF current ratio and the field-effect mobility of the TFT's were about 105 and 0.18cm(2)/V s, respectively. (c) 2006 Elsevier B.V. All rights reserved.
机译:通过金属技术(ITM)的离子注入已被用于形成具有倒置交错电极结构的氢化非晶硅薄膜晶体管(a-Si:H TFT)的源极和漏极区域。金属漏电极和源电极用作散射层。已经成功选择了十纳米厚的漏极和源极金属化钼和钛,以制造具有良好性能的TFT。 TFT的开-关电流比和场效应迁移率分别约为105和0.18cm(2)/ V s。 (c)2006 Elsevier B.V.保留所有权利。

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