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Gate Overlapped Lightly Doped Drain Poly-Si TFTs Employing 45° Tilt Implant For Source and Drain

机译:栅极重叠轻掺杂漏极多晶硅薄膜晶体管,采用45°倾斜注入进行源极和漏极注入

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摘要

We propose a short channel gate overlapped lightly doped drain (GOLDD) poly-Si TFT employing 45° tilt implant for source and drain (S/D) regions without any additional ion doping or mask. Oblique-incident ELA activation is performed to activate both n+ S/D and n- LDD regions as well as cure junction defects. The proposed poly-Si TFT can suppress the anomalous leakage current, and exhibit the better reliability against the hot-carrier stress.
机译:我们提出了一种短沟道栅极重叠轻掺杂漏极(GOLDD)多晶硅TFT,采用45°倾斜注入的方式用于源极和漏极(S / D)区域,而无需任何其他离子掺杂或掩膜。进行斜入射ELA激活以激活n + S / D和n-LDD区域以及固化结缺陷。所提出的多晶硅TFT可以抑制异常漏电流,并表现出更好的可靠性以抵抗热载流子应力。

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