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首页> 外文期刊>Journal of Applied Polymer Science >Crosslinking and decomposition reactions of epoxide-functionalized polynorbornene. II. Impact of reactions on mechanical properties
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Crosslinking and decomposition reactions of epoxide-functionalized polynorbornene. II. Impact of reactions on mechanical properties

机译：环氧官能化聚降冰片烯的交联和分解反应。二。反应对机械性能的影响

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摘要

Low dielectric constant materials are critical to meeting the demand for continual reduction in feature sizes and increase in interconnect density required for future high-speed microelectronic devices. Polymers based on functionalized norbornenes are inherently attractive for these applications as they exhibit good electrical properties such as a low dielectric constant and appealing mechanical properties. Although polynorbornenes inherently possess properties that are attractive for microelectronics packaging, films of these polymers are not solvent-resistant. Solvent-resistant crosslinked films can be attained by generation of acid species to promote cationic crosslinking of epoxide side groups. This article is the second part of a two-part study investigating the crosslinking of a copolymer of decyl norbornene and epoxide norbornene. In the first part of this study, it was proposed that epoxide decomposition reactions are also possible at cure temperatures greater than 160degreesC. This decomposition mechanism results in the complete loss of crosslinkable epoxide groups while leaving the norbornene backbone intact. Although crosslinking and decomposition reactions have independent mechanisms, both reactions directly affect the level of crosslinking. In this part of the study, the solvent swelling behavior, tensile modulus, elongation to break, and residual stress were investigated for polymer films cured under various conditions to validate the proposed mechanisms. The trends observed with these properties are consistent with the counteracting nature of epoxide crosslinking and decomposition reactions. (C) 2003 Wiley Periodicals, Inc. J Appl Polym Sci 91: 1020-1029, 2004. [References: 16]
机译：低介电常数材料对于满足不断缩小特征尺寸和增加未来高速微电子设备所需的互连密度的要求至关重要。基于官能化降冰片烯的聚合物对于这些应用具有内在的吸引力，因为它们表现出良好的电性能，例如低介电常数和吸引人的机械性能。尽管聚降冰片烯固有地具有对微电子包装有吸引力的性能，但是这些聚合物的膜不是耐溶剂的。耐溶剂性交联膜可通过产生酸类物质来促进环氧化物侧基的阳离子交联而获得。本文是由两部分组成的研究的第二部分，该研究研究了癸基降冰片烯和环氧化物降冰片烯的共聚物的交联。在这项研究的第一部分中，有人提出在高于160摄氏度的固化温度下也可能发生环氧分解反应。这种分解机理导致可交联的环氧基团完全丧失，而降冰片烯骨架保持完整。尽管交联和分解反应具有独立的机理，但这两个反应都直接影响交联的程度。在这部分研究中，研究了在各种条件下固化的聚合物膜的溶剂溶胀行为，拉伸模量，断裂伸长率和残余应力，以验证所提出的机理。观察到的具有这些性质的趋势与环氧交联和分解反应的抵消性质一致。 （C）2003 Wiley Periodicals，Inc. J Appl Polym Sci 91：1020-1029，2004. [参考文献：16]

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