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首页> 外文期刊>Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics >The role of copper incorporation on the microstructure, mechanical and tribological properties of TiBN-Cu films by reactive magnetron sputtering
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The role of copper incorporation on the microstructure, mechanical and tribological properties of TiBN-Cu films by reactive magnetron sputtering

机译：铜掺入对TIBN-Cu薄膜微观结构，机械和摩擦学特性的作用，反应磁控溅射

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An experimental study was conducted on a series of Ti-B-N-Cu films via magnetron sputtering of titanium, boron and copper targets. This study aims at assessing the microstructure, mechanical and tribological properties of the Ti-B-N-Cu films by varying the concentration of copper. The deposited film revealed a face-centred cubic TiN structure with a (111) preferred orientation, and its grain size decreased with increasing content of copper. More so, the film exhibited the highest hardness and elastic modulus values of similar to 33.2 GPa and similar to 288.8 GPa respectively when the content of copper in the film was 1.8 at.% which also coincides with the best wear resistance value of the films. The initial increase in hardness is due to grain refinement and an increase in compressive residual stress in the film. Even though the incorporation of copper improved the high-temperature coefficient of friction, the wear rate deteriorates as the content of copper and temperature increases. The presence of tribo-oxides and copper within the wear track acted as a lubricating medium for the reduction of the coefficient of friction whiles the reduced hardness of the films as the copper content in increased resulted in the increased wear rate. Also, the wear rate of the films with the same copper content increases as the test temperature increases from RT to 700 degrees C. Hence caution must be taken when applying copper doped films for high temperature wear resistance operations. (C) 2019 Elsevier B.V. All rights reserved.
机译：通过氧化钛，硼和铜靶的磁控溅射在一系列Ti-B-N-Cu膜上进行实验研究。该研究旨在通过改变铜的浓度来评估Ti-B-N-Cu膜的微观结构，机械和摩擦学性质。沉积的薄膜揭示了具有（111）优选取向的面为中心的立方锡结构，随着铜含量的增加而降低其晶粒尺寸。因此，当薄膜中铜的含量为1.8时，该薄膜分别表现出类似于33.2GPa的最高硬度和弹性模量值和类似于288.8GPa的。％也与薄膜的最佳耐磨性值一致。硬度初始增加是由于晶粒细化和薄膜压缩残余应力的增加。尽管铜的掺入改善了高温系数的摩擦系数，但磨损率随着铜和温度的含量而劣化。耐磨轨道内的摩擦氧化物和铜的存在用作润滑介质，用于减少摩擦系数的摩擦系数，随着铜含量增加，薄膜的硬度降低导致磨损率增加。而且，随着测试温度从RT到700℃的增加，薄膜的磨损率随着试验温度的增加而增加。因此，在施加铜掺杂薄膜时，必须小心用于高温耐磨性操作。 （c）2019 Elsevier B.v.保留所有权利。

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