Low-power-consumption optical interconnect on silicon by transfer-printing for used in opto-isolators

Liu Lei; Loi Ruggero; Roycroft Brendan; OCallaghan James; Trindade Antonio Jose; Kelleher Steven; Gocalinska Agnieszka; Thomas Kevin; Pelucchi Emanuele; Bower Christopher A.; Corbett Brian

首页> 外文期刊>Journal of Physics, D. Applied Physics: A Europhysics Journal >Low-power-consumption optical interconnect on silicon by transfer-printing for used in opto-isolators

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Low-power-consumption optical interconnect on silicon by transfer-printing for used in opto-isolators

机译：通过用于光隔离器中使用的转印印刷对硅的低功耗光学互连

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On-chip optical interconnects heterogeneously integrated on silicon wafers by transfer-print technology are presented for the first time. Thin (5 mu m), micron sized light-emitting diodes (LEDs) and photo diodes (PDs) are prefabricated and transfer-printed to silicon wafer with polymer waveguides built between them. Data transmission with total power consumption as low as 1 mW, signal to noise ratio of 250 and current transfer ratio of 0.1% in a compact volume of 0.0004mm(3) are demonstrated. Experiment shows that the polymer waveguide between the LED and PD plays a key role in enhancing the data transmission efficiency. Reciprocal performance for bidirectional transmission is also achieved. The results show the potential for cost-effective and low profile form-factor on-chip opto-isolators.

机译：首次呈现通过转印印刷技术在硅晶片上非渗透地集成的片上光学互连。薄（＆LT;5μm），微米尺寸的发光二极管（LED）和光电二极管（PDS）是预制的，并将其传送到与它们之间的聚合物波导的硅晶片。数据传输具有低至1 MW的总功耗，信号至噪声比率为＆ 250和电流传递比为0.1％的紧凑型＆ 0.0004mm（3）。实验表明，LED和PD之间的聚合物波导在提高数据传输效率方面发挥着关键作用。还实现了双向传输的互惠性能。结果表明了成本效益和低轮廓形式因子片上的芯片光隔离器的可能性。

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来源
《Journal of Physics, D. Applied Physics: A Europhysics Journal》 |2019年第6期|共8页
作者
Liu Lei; Loi Ruggero; Roycroft Brendan; OCallaghan James; Trindade Antonio Jose; Kelleher Steven; Gocalinska Agnieszka; Thomas Kevin; Pelucchi Emanuele; Bower Christopher A.; Corbett Brian;
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作者单位

Tyndall Natl Inst Cork Ireland;

Tyndall Natl Inst Cork Ireland;

Tyndall Natl Inst Cork Ireland;

Tyndall Natl Inst Cork Ireland;

X Celeprint Ltd Cork Ireland;

X Celeprint Ltd Cork Ireland;

Tyndall Natl Inst Cork Ireland;

Tyndall Natl Inst Cork Ireland;

Tyndall Natl Inst Cork Ireland;

X Celeprint Ltd Cork Ireland;

Tyndall Natl Inst Cork Ireland;

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原文格式 PDF
正文语种 eng
中图分类应用物理学;
关键词
optical interconnects; photonic integrated circuits; heterogeneous integration;

机译：光学互连;光子集成电路;异构集成;

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专利

1. Low-power-consumption optical interconnect on silicon by transfer-printing for used in opto-isolators [J] . Liu Lei, Loi Ruggero, Roycroft Brendan, Journal of Physics, D. Applied Physics: A Europhysics Journal . 2019,第6期

机译：通过用于光隔离器中使用的转印印刷对硅的低功耗光学互连
2. Selective area growth of germanium and germanium/silicon-germanium quantum wells in silicon waveguides for on-chip optical interconnect applications [J] . S. A. Claussen, K. C. Balram, E. T. Fei, Optical Materials Express . 2012,第10期

机译：用于芯片上光互连应用的硅波导中锗和锗/硅锗锗量子阱的选择性区域生长
3. Selective area growth of germanium and germanium/silicon-germanium quantum wells in silicon waveguides for on-chip optical interconnect applications [J] . S. A. Claussen, K. C. Balram, E. T. Fei, Optical Materials Express . 2012,第10期

机译：用于芯片上光互连应用的硅波导中锗和锗/硅锗锗量子阱的选择性区域生长
4. Low-power-consumption, 40-Gb/s Mach-Zehnder silicon optical modulator [C] . 2012 Asia Communications and Photonics Conference . 2012

机译：低功耗40 Gb / s Mach-Zehnder硅光学调制器
5. Silicon and Epitaxially Grown III-V-On-Silicon Photonic Devices for On-Chip Optical Interconnects. [D] . Feng, Shaoqi. 2013

机译：用于片上光学互连的硅和外延生长的III-V-硅上光子器件。
6. Monolithic 1 × 8 DWDM Silicon Optical Transmitter Using an Arrayed-Waveguide Grating and Electro-Absorption Modulators for Switch Fabrics in Intra-Data-Center Interconnects [O] . Uiseok Jeong, Dong Ho Lee, Kyungwoon Lee, 2020

机译：单片1×8 DWDM硅光学发射器使用阵列 - 波导光栅和用于数据库内互连的开关织物的电吸收调制器
7. 25-Gbps/ch Error-Free Operation over 300-m MMF of Low-Power-Consumption Silicon-Photonics-Based Chip-Scale Optical I/O Cores [O] . Kenichiro YASHIKI, Toshinori UEMURA, Mitsuru KURIHARA, 2016

机译：基于低功耗的低功耗硅光子芯片级光学I / O芯上的25-Gbps / Ch无差错操作超过300米MMF

Low-power-consumption optical interconnect on silicon by transfer-printing for used in opto-isolators

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