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首页> 外文期刊>International Journal of Adhesion & Adhesives >Development of a cornstarch adhesive for laminated veneer lumber bonding for use in engineered wood flooring
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Development of a cornstarch adhesive for laminated veneer lumber bonding for use in engineered wood flooring

机译：研制玉米淀粉粘合剂，用于改造木地板的层压贴面板粘合

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摘要

To produce aldehyde-free engineered wood flooring, we developed a cornstarch-based adhesive for laminated veneer lumber bonding. Polyvinyl alcohol was used as the tackifier, wheat flour as the filler, and polyisocyanate prepolymer as the reinforcing agent. After the application of the cornstarch adhesive to the engineered wood flooring, we found that the cornstarch adhesive had excellent adhesion in the laminated wood parquet. The properties of the cornstarch-based adhesive met the requirements of GB/T 14074-2006, GB/T 20241-2006, and GB/T 18103-2006 for non-structure interior adhesives. When lumber veneer (thickness, <= 2.2 mm) was used, the engineered wood flooring showed good dimensional stability after 1-2 min of hot-pressing pretreatment (temperature, 100-120 degrees C; pressure, 0.83 MPa). The main physical and chemical properties also met the requirements of GB/T18103-2000, Engineered Wood Flooring. The emission of formaldehyde during production was <= 0.05 mg/l, lower than the GB/T18103-2000 requirement of <= 0.124 mg/l. The results of this study provide practical and forward-looking guidelines for expanding the application of biomass-based adhesives in the manufacture of laminated veneer lumber.
机译：为了生产无醛的工程木地板，我们开发了一种基于玉米淀粉的粘合剂，用于层压单板木材粘合剂。将聚乙烯醇用作增粘剂，小麦粉作为填料，以及作为增强剂的多异氰酸酯预聚物。在将玉米淀粉粘合到工程木地板上之后，我们发现玉米淀粉粘合剂在层压木地板中具有优异的粘附性。基于玉米淀粉的粘合剂的性质符合非结构内粘合剂GB / T 14074-2006，GB / T 20241-2006和GB / T 18103-2006的要求。当使用木材贴面（厚度<= 2.2毫米）时，工程木地板在热压预处理1-2分钟后显示出良好的尺寸稳定性（温度，100-120℃;压力，0.83MPa）。主要的物理和化学性质也符合GB / T18103-2000，工程木地板的要求。生产过程中甲醛的排放为<= 0.05mg / L，低于GB / T18103-2000的要求<= 0.124mg / L.本研究的结果提供了实用和前瞻性的准则，用于扩大生物质基粘合剂在制造层压贴面木材中的应用。

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