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首页> 外文期刊>Numerical Heat Transfer, Part A. Application: An International Journal of Computation and Methodology >On the junction temperature of the QFN64 electronic package subjected to free convection: Effects of the encapsulating molding compound
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On the junction temperature of the QFN64 electronic package subjected to free convection: Effects of the encapsulating molding compound

机译：在经受游离对流的QFN64电子包装的结温上：封装成型化合物的影响

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摘要

The thermal conductivity of the molding compound (resin) used to encapsulate the QFN64 package significantly affects the thermal behavior of this electronic package during operation when it is subjected to natural convection. These effects are quantified in this work by varying the conductivity between 80% and +100% of its average value. The 3D numerical solution carried out by means of the control volume method clearly shows that the maximal temperature reached in the junction of the device is affected by this parameter for a wide range of the generated power and various inclinations relative to the horizontal plane. The correlation proposed in this work allows optimizing the thermal design and increases the reliability, durability, performance, and correct operating of this electronic device widely used in various engineering fields.
机译：用于封装QFN64封装的模塑化合物（树脂）的导热率显着影响其在经历自然对流时在操作期间的热行为。 通过改变其平均值的80％和+ 100％之间的电导率，在这项工作中量化这些效果。 借助于控制体积方法执行的3D数值溶液清楚地表明，该装置的结达到的最大温度受该参数的影响，用于相对于水平面的各种产生的功率和各种倾斜度。 本工作中提出的相关性允许优化热设计并提高在各种工程领域广泛使用的电子设备的可靠性，耐用性，性能和正确操作。

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