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首页> 外文期刊>DVS-Berichte >Reaction-assisted bonding of Ti6Al4V alloy with Ti/Ni reactive nanostructured multilayers and interdiffusion behavior simulation employing molecular dynamics modelling
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Reaction-assisted bonding of Ti6Al4V alloy with Ti/Ni reactive nanostructured multilayers and interdiffusion behavior simulation employing molecular dynamics modelling

机译：Ti6Al4V合金与Ti / Ni反应性纳米结构的反应辅助键合和采用分子动力学建模的相互扩散行为模拟

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摘要

Reaction-assisted bonded interfaces with reactive nano-multilayer film (RMF) show a high potential for microsystem application due to the low joining temperatures, low bonding pressure and the resulting high mechanical strength of bonded joints. Three Ti/Ni nano-multilayer film systems with different Ti/Ni ratios were prepared. Then, diffusion bonding of Ti6Al4V alloy were performed with prepared RMLF as interlayer. The effect of Ti/Ni ratios, bonding pressure and bonding temperature on the joint strength was discussed. Reliable joints can be obtained successfully with all three multilayer. A higher pressure and higher Ni content in the multilayers contributed to a higher shear strength. The highest shear strength of 160 MPa was achieved for the joint under 15 MPa with the stoichiometry ratio of Ti/Ni of 1:3, while the hardness of the joint was 6.9 GPa. The intermediate phases appeared to be combinations of hard intermetallics. With the increase of temperature, the residual microstructure of the nickel-rich film gradually disappears, and Ni diffuses fully in TC4, which can form a dense joint. There is a negative correlation between the strength and hardness of the joint. In addition, molecular dynamics (MD) simulation was also applied to reveal the interdiffusion of Ti and Ni at elevated temperatures. MD simulation study shows that temperature significantly affects the diffusion behavior of atoms, as the temperature increases, the diffusion coefficient increases gradually. When the atomic ratio of Ti/Ni is close to 1.33, it has a small viscosity thus atoms diffusion can be accelerated, which is beneficial to the self-propagating exothermic reaction.
机译：具有反应性纳米 - 多层膜（RMF）的反应辅助键合界面由于低接合温度，低粘接压力和所得到的粘结接头的高机械强度而显示微系统施用的高潜力。制备具有不同Ti / Ni比率的三个Ti / Ni纳米多层薄膜系统。然后，用制备的RMLF作为中间层进行Ti6Al4V合金的扩散键合。讨论了Ti / Ni比率，键合压力和粘合温度对关节强度的影响。可靠的关节可以成功获得所有三个多层。多层中的较高压力和更高的Ni含量导致更高的剪切强度。在15MPa下的接头实现160MPa的最高剪切强度，其化学计量比为1：3，而关节的硬度为6.9GPa。中间阶段似乎是硬质采矿的组合。随着温度的增加，富含镍的薄膜的残留微观结构逐渐消失，并且Ni在TC4中完全扩散，其可以形成密集的关节。关节的强度和硬度之间存在负相关性。此外，还施加了分子动力学（MD）模拟以揭示Ti和Ni在升高的温度下的相互积分。 MD仿真研究表明，随着温度升高，温度显着影响原子的扩散行为，扩散系数逐渐增加。当Ti / Ni的原子比接近1.33时，它具有小的粘度，因此可以加速原子扩散，这有利于自我繁殖的放热反应。

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