Wetting properties of Nd:YAG laser treated copper by SAC solders

Hlinka Jozsef; Berczeli Miklos; Buza Gabor; Weltsch Zoltan

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Wetting properties of Nd:YAG laser treated copper by SAC solders

机译：Nd的润湿性质：囊焊接的YAG激光处理过的铜

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Purpose - This paper aims to discuss the effect of surface treatment on the wettability between copper and a lead-free solder paste. The industrial applications of laser technologies are increasing constantly. A specific laser treatment can modify the surface energy of copper and affect the wetting properties.

机译：None

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来源
《Soldering & Surface Mount Technology》 |2017年第2期|共6页
作者
Hlinka Jozsef; Berczeli Miklos; Buza Gabor; Weltsch Zoltan;
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作者单位

Budapest Univ Technol &

Econ Dept Automobiles &

Vehicles Mfg Budapest Hungary;

Budapest Univ Technol &

Econ Dept Automobiles &

Vehicles Mfg Budapest Hungary;

Bay Zolton Nonprofit Ltd Appl Res Dept Laser Technol Budapest Hungary;

Pallasz Athene Univ Dept Mat Technol Kecskemet Hungary;

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原文格式 PDF
正文语种 eng
中图分类焊接一般性问题;
关键词
Microstructure; Sn-Ag-Cu; Solder; Wetting; Laser treatment;

机译：微观结构;SN-AG-CU;焊料;润湿;激光治疗;

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1. Mechanical properties of QFP micro-joints soldered with lead-free solders using diode laser soldering technology [J] . HAN Zong-jie, XUE Song-bai, WANG Jian-xin, 中国有色金属学报（英文版） . 2008,第004期
2. Dielectric properties of copper-ethanolamine treated Chinese fir (Cunninghamia lanceolata Hook. ) [J] . Cao Jin-zhen, Yu Li-li, You Xiao-di, 中国林学（英文版） . 2007,第004期
3. Wetting properties, recrystallization phenomena and interfacial reactions between laser treated Cu substrate and SAC305 solder [J] . Hlinka Jozsef, Fogarassy Zsolt, Cziraki Agnes, Applied Surface Science . 2020,第Jana31期

机译：激光处理的铜基板和SAC305焊料之间的润湿特性，再结晶现象和界面反应
4. Investigation of microstructure and wetting behavior of Sn-3.0Ag-0.5Cu (SAC305) lead-free solder with additions of 1.0 wt % SiC on copper substrate [J] . Pal Manoj Kumar, Gergely Greta, Koncz-Horvath Daniel, Intermetallics . 2021,第1期

机译：Sn-3.0AG-0.5Cu（SAC305）无铅焊料的微观结构和润湿行为研究在铜基材上添加1.0wt％SiC
5. Spreading Behavior and Evolution of IMCs During Reactive Wetting of SAC Solders on Smooth and Rough Copper Substrates [J] . SATYANARAYAN, K. N. PRABHU Journal of Electronic Materials . 2013,第8期

机译：SAC焊料在光滑粗糙铜基板上的反应性润湿过程中IMC的扩散行为和演变
6. Effect of fibre-lasers parameters on interfacial reaction and wetting angle of two different types of SAC305 solder fabrication on Cu pad [C] . T J Nabila, S R A Idris, M Ishak International Postgraduate Conference on Mechanical Engineering . 2019

机译：纤维激光参数对Cu垫两种不同类型SAC305焊料制造的界面反应和润湿角度的影响
7. Analysis of lead free tin-silver-copper and tin-lead solder wetting reactions. [D] . Anson, Scott J. 2007

机译：分析无铅锡银铜和锡铅焊料的润湿反应。
8. Soldering Electronics to Smart Textiles by Pulsed Nd:YAG Laser [O] . Sebastian Micus, Michael Haupt, Götz T. Gresser 2020

机译：通过脉冲Nd：YAG激光将电子焊接到智能纺织品
9. WETTING BEHAVIORS AND INTERFACIAL PROPERTIES OF SAC300, SAC305 AND SAC0307 TERNARY Pb-FREE SOLDER ALLOYS [O] . Ahmet Mustafa Erer 2017

机译：SAC300，SAC305和SAC0307三元PB免焊合金的润湿行为和界面性能
10. Wick wetting experiments for copper vapor lasers. [R] . Rothman, A. J. 1986

机译：铜蒸气激光器的吸湿润实验。

Wetting properties of Nd:YAG laser treated copper by SAC solders

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