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首页> 外文期刊>International Journal of Solids and Structures >Mode III crack problems for two bonded functionally graded piezoelectric materials
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Mode III crack problems for two bonded functionally graded piezoelectric materials

机译：两种键合功能梯度压电材料的III型裂纹问题

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摘要

This paper investigates the singular electromechanical field near the crack tips of an internal crack. The crack is perpendicular to the interface formed by bonding two half planes of different functionally graded piezoelectric material. The properties of two materials, such as elastic modulus, piezoelectric constant and dielectric constant, are assumed in exponential forms and vary along the crack direction. The singular integral equations for impermeable and permeable cracks are derived and solved by using the Gauss-Chebyshev integration technique. It shows that the stresses and electrical displacements around the crack tips have the conventional square root singularity. The stress intensity and electric displacement intensity factors are highly affected by the material nonhomogeneity parameters beta and gamma. The solutions for some degenerated problems can also be obtained. (C) 2004 Elsevier Ltd. All rights reserved.
机译：本文研究了内部裂纹的裂纹尖端附近的奇异电场。裂纹垂直于通过粘结不同功能梯度压电材料的两个半平面形成的界面。两种材料的特性（例如弹性模量，压电常数和介电常数）以指数形式表示，并沿裂纹方向变化。利用Gauss-Chebyshev积分技术推导并求解了不可渗透和可渗透裂缝的奇异积分方程。结果表明，裂纹尖端周围的应力和电位移具有常规的平方根奇异性。应力强度和电位移强度因子受材料非均匀性参数beta和γ的影响很大。还可以获得一些退化问题的解决方案。 （C）2004 Elsevier Ltd.保留所有权利。

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