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首页> 外文期刊>Electronic Device Failure Analysis: A Resource for Technical Information and Industry Developments >CRAIC's 20/20XL Offers Nondestructive Film-Thickness Measurement
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CRAIC's 20/20XL Offers Nondestructive Film-Thickness Measurement

机译：CRAIC的20 / 20XL提供无损膜厚测量

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CRAIC Technologies (San Dimas, Calif.) has developed a new solution for the semiconductor industry: the 20/20 XL film-thickness measurement tool. The 20/20 XL is a microspectrophotometer designed to nondestructively analyze microscopic areas of very large samples. This system offers the capability to measure the thickness of thin films in both transmission and reflectance. It also offers the capability to measure the Raman spectra of microscopic samples, along with ultraviolet (UV) and near-infrared (NIR) microscopy of semiconductors and other types of samples. Due to its flexible design, which gives it the capability to analyze the largest samples, applications are numerous and include mapping thin-film thickness of large devices, locating and identifying contaminants, measuring strain in silicon, and much more. With the capability to spectrally analyze and image microscopic samples or microscopic areas on large devices, the 20/20 XL microspectrophotometer is the cutting-edge microanalysis tool for manufacturing facilities.
机译：CRAIC Technologies（加利福尼亚州圣迪马斯）为半导体行业开发了一种新的解决方案：20/20 XL膜厚测量工具。 20/20 XL是一种显微分光光度计，旨在无损分析非常大的样品的微观区域。该系统具有测量透射和反射薄膜厚度的能力。它还具有测量显微样品的拉曼光谱的能力，以及半导体和其他类型样品的紫外（UV）和近红外（NIR）显微镜。由于其灵活的设计使其具有分析最大样品的能力，因此其应用非常广泛，包括绘制大型设备的薄膜厚度，定位和识别污染物，测量硅中的应变等等。 20/20 XL显微分光光度计具有对大型设备上的微观样品或微观区域进行光谱分析和成像的能力，是用于制造设施的尖端微观分析工具。

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