Aiming to eliminate worker exposure to the hazards of lead,electronics manufacturers around the world are making the shift to lead-free solder for circuit assembly.Owing to the higher temperatures required for reflow of lead-free solder,its burgeoning use is spurring profound changes in the materials used to make electronic components.Assembly line temperatures employed with lead-free solder are typically in the 250 to 260 ° C range-about 20 to 30 degrees higher than those employed with conventional lead-based solder.
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