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首页> 外文期刊>Materials transactions >Contact Resistance Comparison of Flip-Chip Joints Produced with Anisotropic Conductive Adhesive and Nonconductive Adhesive for Smart Textile Applications
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Contact Resistance Comparison of Flip-Chip Joints Produced with Anisotropic Conductive Adhesive and Nonconductive Adhesive for Smart Textile Applications

机译：各向异性导电胶和非导电胶在智能纺织应用中生产的倒装芯片接头的接触电阻比较

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摘要

For applications in smart textiles, flip-chip bonding was applied with either an anisotropic conductive adhesive (ACA) or a nonconductive adhesive (NCA) to a heat-resistant fabric and a Si substrate as a reference. The average contact resistances of the flip-chip joints produced with each adhesive on each substrate were evaluated with varying the Cu and Sn thicknesses inversely over the range of 0-15 mu m to maintain a total thickness of 15 mu m of the Cu/Sn bump. The contact resistances of the flip-chip joints produced with ACA on Si, NCA on Si, ACA on fabric, and NCA on fabric were 6.5-12.2 m Omega, 15.6-26.5 m Omega, 5.3-10.2 m Omega, and 5.5-10.1 m Omega, respectively.
机译：对于智能纺织品中的应用，将各向异性导电粘合剂（ACA）或非导电粘合剂（NCA）倒装芯片粘合到耐热织物和Si基板上作为参考。用每种粘合剂在每个基板上产生的倒装芯片接头的平均接触电阻通过在0-15微米范围内反向改变Cu和Sn厚度以保持15微米的Cu / Sn总厚度来评估磕碰。用硅上的ACA，硅上的NCA，织物上的ACA和织物上的NCA制作的倒装芯片接头的接触电阻分别为6.5-12.2 m Omega，15.6-26.5 m Omega，5.3-10.2 m Omega和5.5-10.1米欧米茄分别。

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