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Reliability Investigation of Multilayer Interconnection Boards (Mib'S)

机译：多层互连板可靠性研究（mib's）

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The results of a test program to investigate failure mechanisms of Multilayer Interconnection Boards (MIB's) are reported. The overall objective was a more fundamental understanding of the reliability characteristics of MIB's, as related to design, manufacturing and environmental variables. The test approach used was an experimental type of accelerated testing, called 'enhanced-defects' testing. Implementation was successfully carried out using two special MIB Test Vehicles designed to exhibit controlled-enhancement of failure occurrence during environmental tests. Test samples were prepared by marginal off-setting of selected design and processing variables. Test results for MIB open failure modes revealed a PTH-fracture failure mechanism which occurs as a result of temperature change, and is relatable to MIB material properties, PTH geometry and processing variables. MIB short failure modes were shown to be largely dependent on temperature and relative humidity but also relatable to MIB design variables, e.g., line spacing and processing variables. Failure models for MIB failure mechanisms are postulated. (Author)

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