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首页> 美国政府科技报告 >Reliability Investigation of Thermal Stress/Fatigue Failure in Multilayer Interconnection Boards
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Reliability Investigation of Thermal Stress/Fatigue Failure in Multilayer Interconnection Boards

机译：多层互连板热应力/疲劳失效的可靠性研究

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Results are reported on the failure mechanisms of multilayer interconnection boards (MIBs) subjected to long-term temperature-cycling tests. The underlying failure process, consisting of low-cycle copper fatigue and leading to circuit open due to fracture, was found to occur at different rates and in different locations as a function of: (1) MIB design geometry and material parameters; (2) manufacturing process parameters; and (3) temperature cycling test profile values. Of particular interest is the presentation of comparative test results showing that straight-wall PTH (plated-through-hole) construction provides somewhat greater resistance to thermal fatigue than does etched-back PTH construction. Results are also given for comparative tests on early-vintage MIBs fabricated using polyimide materials and fluroborate-copper PTH plating. (Author)

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