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The Interplay of Surface Mount Solder Joint Quality and Reliability of Low Volume SMAs

机译：表面贴装焊点质量与低容量sma可靠性的相互作用

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摘要

Spacecraft electronics including those used at the Jet Propulsion Laboratory (JPL), demand production of highly reliable assemblies. JPL has recently completed an extensive study, funded by NASA's code Q, of the interplay between manufacturing defects and reliability of ball grid array (BGA) and surface mount electronic components.

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作者
Ghaffarian, R.;
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年度 1997
页码 1-12
总页数 12
原文格式 PDF
正文语种 eng
中图分类工业技术;
关键词
DEFECTS; MANUFACTURING; RELIABILITY; SOLDERS; SUPPORTS; Spacecraft electronics electronic assemblies J-leads solder joint defects joint; defects SMT;

机译：缺陷;制造业;可靠性;焊料;支撑物;航天器电子电子组件J型引线焊点缺陷接头;缺陷smT;

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1. Reliability Study of Solder Paste Alloy for the Improvement of Solder Joint at Surface Mount Fine-Pitch Components [J] . Jaharah A. Ghani, Javier Narciso, Mohd Nizam Ab. Rahman, Materials . 2014,第12期

机译：锡膏合金的可靠性研究，以改善表面安装细间距元件的焊点
2. Reliability Study of Solder Paste Alloy for the Improvement of Solder Joint at Surface Mount Fine-Pitch Components [J] . Jaharah A. Ghani, Javier Narciso, Mohd Nizam Ab. Rahman, Materials . 2014,第12期

机译：锡膏合金的可靠性研究，以改善表面安装细间距元件的焊点
3. Improvement of reliability and fatigue life of solder joint for surface mounted chip parts [J] . Takushi Miyake 溶接技術 . 2000,第9期

机译：改善表面贴装芯片零件焊点的可靠性和疲劳寿命
4. The interplay of surface mount quality and reliability of low volume SMAs [C] . R. Ghaffarian TMS Annual Meeting . 1997

机译：表面贴装质量的相互作用和低卷SMA的可靠性
5. Lead-free solders in surface mount electronic assemblies: Designs for quality and reliability [D] . Dang, Tung C. 2011

机译：表面安装电子组件中的无铅焊料：质量和可靠性设计
6. Reliability Study of Solder Paste Alloy for the Improvement of Solder Joint at Surface Mount Fine-Pitch Components [O] . Mohd Nizam Ab. Rahman, Noor Suhana Mohd Zubir, Raden Achmad Chairdino Leuveano, 2014

机译：锡膏合金的可靠性研究以改善表面安装细间距元件的焊点
7. Thermal Fatigue Reliability and Mechanical Fatigue Reliability of Sn-Zn Solder Joints in Surface Mounting Process under Environmental Test [O] . Tomoya KIGA, Shinya HATTORI, Yuichi IWANABE 2003

机译：环境试验下表面安装过程中SN-ZN焊点的热疲劳可靠性和机械疲劳可靠性
8. Effect of Au on the reliability of fine pitch surface mount solder joints. [R] . Glazer, J., Kramer, P., Morris, J. W. 1991

机译：au对细间距表面贴装焊点可靠性的影响。

The Interplay of Surface Mount Solder Joint Quality and Reliability of Low Volume SMAs

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