首页> 外国专利> IMPROVED CLADDING LAYER EPITAXY VIA TEMPLATE ENGINEERING FOR HETEROGENEOUS INTEGRATION ON SILICON

IMPROVED CLADDING LAYER EPITAXY VIA TEMPLATE ENGINEERING FOR HETEROGENEOUS INTEGRATION ON SILICON

机译:通过模板工程改进的包覆层表观外延,用于硅上的异质结合

摘要

A semiconductor body comprising a channel region and junction regions disposed on opposite sides of the channel region, the semiconductor body comprising: a first material comprising a first band gap; And a second material comprising a second band gap different from the first band gap, wherein the plurality of nanowires are separated through the first material such that the first material surrounds each of the plurality of nanowires. Placed on the planes-including-; And a gate stack disposed on the channel region. Forming a plurality of nanowires in separate planes on the substrate, each of the plurality of nanowires comprising a material comprising a first band gap; Individually forming a cladding material around each of the plurality of nanowires, the cladding material comprising a second band gap; Joining the cladding material; And placing a gate stack on the cladding material.
机译:一种半导体本体,包括沟道区和设置在沟道区的相对侧上的结区,该半导体本体包括:第一材料,其包括第一带隙;以及第二材料,其包括第一带隙。以及第二材料,其包括不同于所述第一带隙的第二带隙,其中,所述多个纳米线通过所述第一材料分开,使得所述第一材料围绕所述多个纳米线中的每一个。放在飞机上-包括-;栅堆叠设置在沟道区上。在衬底上的分离平面中形成多个纳米线,所述多个纳米线中的每一个包括具有第一带隙的材料;在多个纳米线的每一个周围分别形成包层材料,该包层材料包括第二带隙;连接覆层材料;并将栅极叠层放置在覆层材料上。

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号