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Method of fine tuning a magnetron sputtering electrode in a rotatable cylindrical magnetron sputtering device

机译：在可旋转圆柱形磁控管溅射装置中微调磁控管溅射电极的方法

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摘要

A magnetron sputtering electrode for use in a rotatable cylindrical magnetron sputtering device, the electrode including a cathode body defining a magnet receiving chamber and a cylindrical target surrounding the cathode body. The target is rotatable about the cathode body. A magnet arrangement is received within the magnet receiving chamber, the magnet arrangement including a plurality of magnets. A shunt is secured to the cathode body and proximate to a side of the magnet arrangement, the shunt extending in a plane substantially parallel to the side of the magnet arrangement. A method of fine-tuning a magnetron sputtering electrode in a rotatable cylindrical magnetron sputtering device is also disclosed.

机译：一种可旋转的圆柱形磁控管溅射装置中使用的磁控管溅射电极，该电极包括限定磁体接收室的阴极主体和围绕该阴极主体的圆柱形靶。靶可绕阴极体旋转。磁体装置容纳在磁体容纳室内，该磁体装置包括多个磁体。分流器固定到阴极主体并靠近磁体装置的侧面，该分流器在基本平行于磁体装置的侧面的平面中延伸。还公开了一种在可旋转的圆柱形磁控管溅射装置中微调磁控管溅射电极的方法。

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公开/公告号US9812304B2

专利类型
公开/公告日2017-11-07

原文格式PDF
申请/专利权人 ANGSTROM SCIENCES INC.;
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申请/专利号US201514594336
发明设计人 MARK A. BERNICK;RICHARD NEWCOMB;
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申请日2015-01-12
分类号C23C14;C25B11;C25B13;H01J37/34;C23C14/34;C23C14/35;C23C14/54;
国家 US
入库时间 2022-08-21 13:43:27

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